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UE75-A30-6000T PDF预览

UE75-A30-6000T

更新时间： 2024-02-25 03:24:15
品牌 Logo 应用领域
安费诺 - AMPHENOL 连接器
页数 文件大小 规格书
3页 85K
描述
Telecom and Datacom Connector

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中文翻译

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UE75-A30-6000T 技术参数

是否Rohs认证： 符合生命周期：Active
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8536.69.40.30Factory Lead Time：10 weeks 1 day
风险等级：5.65连接器类型：TELECOM AND DATACOM CONNECTOR
联系完成配合：NOT SPECIFIED触点材料：PHOSPHOR BRONZE
Base Number Matches：1

UE75-A30-6000T 数据手册

 浏览型号UE75-A30-6000T的Datasheet PDF文件第2页浏览型号UE75-A30-6000T的Datasheet PDF文件第3页 
4
8
5
3
2
7
6
1
REVISIONS  
REV.  
ZONE  
DESCRIPTION  
DATE  
APPROVED  
A.G  
.228 5.80  
.212 5.40  
PIN 30  
PIN 16  
E
F
PLATING 5 & 6 ADDED  
MATING END GAP DIM. ADDED  
DRAWING UPDATE  
2007/04/05  
2008/09/03  
2012/03/21  
A.G  
G
ZLJ  
PART NUMBER  
(NOT INCLUDING  
MATERIAL NOTES  
PACKAGEING TYPE)  
D
D
.352 8.94  
PLASTIC HOUSING:  
CONTACTS:  
PHOSPHOR BRONZE  
HIGH TEMPERATURE RESISTANT PLASTIC  
COLOUR: BLACK  
FLAMIBILITY RATING UL94V-0  
PLATING OPTION 1: (U75 ONLY)  
DATE CODE  
30μ" [0.76 μm] MIN. GOLD ON MATING  
AREA AND 100 - 150μ" [3.81 - 7.62 μm]  
MIN. TIN/LEAD (90/10) PLATING ON  
TERMINATION OVER 50μ" [1.27 μm]  
MIN. NICKEL UNDER LAYER  
POSITION #1  
INDICATOR  
PACKAGING:  
TAPE AND REEL RACKAGING  
.2126 5.40  
.228 5.80  
TEMPERATURE RANGE:  
-40 C TO +85 C  
PLATING OPTION 2: (RoHS FOR UE75 ONLY)  
30μ" [0.76 μm] MIN. GOLD ON MATING  
AREA AND 2μ" [0.05 μm] GOLD FLASH  
PLATING ON TERMINATION OVER 50μ"  
[1.27 μm] MIN. NICKEL UNDER LAYER  
PIN 1  
.591 15.00  
+.002  
.016  
+0.05  
-0.10  
PLATING OPTION 3: (RoHS FOR UE75 ONLY)  
30μ" [0.76 μm] MIN. GOLD ON MATING  
AREA AND 100 - 150μ" [3.81 - 7.62 μm]  
MIN. LOW WHISKER MATTE TIN PLATING  
ON TERMINATION OVER 50μ" [1.27 μm]  
MIN. NICKEL UNDER LAYER  
.528±.003 13.40±0.08  
A
0.41  
C
C
-.004  
.207 MAX 5.25 MAX  
PLATING OPTION 4: (U75 ONLY)  
15μ" [0.38 μm] MIN. GOLD ON MATING  
AREA AND 100 - 150μ" [3.81 - 7.62 μm]  
MIN. TIN/LEAD (90/10) PLATING ON  
TERMINATION OVER 50μ" [1.27 μm]  
MIN. NICKEL UNDER LAYER  
.046 1.16  
.106 2.70  
B
.043 1.08  
.175 4.44  
PLATING OPTION 5: (RoHS FOR UE75 ONLY)  
15μ" [0.38 μm] MIN. GOLD ON MATING  
AREA AND 2μ" [0.05 μm] GOLD FLASH  
PLATING ON TERMINATION OVER 50μ"  
[1.27 μm] MIN. NICKEL UNDER LAYER  
.535 13.60  
B
B
PLATING OPTION 6: (RoHS FOR UE75 ONLY)  
15μ" [0.38 μm] MIN. GOLD ON MATING  
AREA AND 100 - 150μ" [3.81 - 7.62 μm]  
MIN. LOW WHISKER MATTE TIN PLATING  
ON TERMINATION OVER 50μ" [1.27 μm]  
MIN. NICKEL UNDER LAYER  
.035 0.90  
D
AMPHENOL PART NUMBER CONFIGURATION  
UX75 - A 30 - X 0 0 0 T  
.055 1.40  
.0023 [0.06]  
SFP RECEPTALE  
CONTACT PLATING (SEE MATERIAL NOTES)  
M
S
B A  
U75 = NON-RoHS  
UE75 = RoHS COMPLIANCE  
(FOR U75 NON-RoHS)  
1 = PLATING OPTION 1  
4 = PLATING OPTION 4  
(FOR UE75 RoHS)  
2 = PLATING OPTION 2  
3 = PLATING OPTION 3  
5 = PLATING OPTION 5  
6 = PLATING OPTION 6  
.055 1.40  
C
M
S
S
.0023 [0.06]  
B A  
C
A
UNLESS OTHERWISE SPECIFIED  
APPROVALS  
DATE  
.010 0.25  
0.004 [0.10]  
DIMENSIONS ARE IN MILLIMETERS  
TOLERANCES ARE:  
A
Amphenol Canada Corp.  
DRAWN  
S
C D  
2005/12/02  
2005/12/02  
J. SI  
DECIMALS  
ANGLES  
TITLE  
DESIGNED  
CHECKED  
QA APPD  
IE APP'D  
(TYP. 30 SOLDER TAILS)  
J.SI  
X
XFP 30 POSITION HIGH SPEED  
CONNECTOR RECEPTACLE FIXED  
BOARD, RIGHT ANGLE SMT  
X
MATERIAL AND FINISH  
N/A  
DO NOT SCALE DRAWING  
REF.  
SIZE  
DWG.  
REV.  
NO. UX75-A30-X000X  
THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE  
OR USED FOR MANUFACTURING PUPOSES WITHOUT PERMISSION FROM AMPHENOL CANADA CORP.  
G
A
CODE IDENT. NO.  
DWG APP'D  
SCALE  
SHEET  
PROJECT  
03554  
NTS  
1 OF 3  
8
5
4
7
3
2
6
1
123

中文翻译

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