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UC3610Q PDF预览

UC3610Q

更新时间: 2024-01-20 20:39:43
品牌 Logo 应用领域
德州仪器 - TI 肖特基二极管
页数 文件大小 规格书
13页 647K
描述
DUAL SCHOTTKY DIODE BRIDGE

UC3610Q 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:LCC
包装说明:S-PQCC-J20针数:20
Reach Compliance Code:not_compliantHTS代码:8541.10.00.80
风险等级:5.79最小击穿电压:50 V
配置:COMPLEX二极管元件材料:SILICON
二极管类型:BRIDGE RECTIFIER DIODE最大正向电压 (VF):1.3 V
JEDEC-95代码:MS-018AAJESD-30 代码:S-PQCC-J20
最大非重复峰值正向电流:3 A元件数量:8
相数:1端子数量:20
最高工作温度:70 °C最低工作温度:
最大输出电流:3 A封装主体材料:PLASTIC/EPOXY
封装形状:SQUARE封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED最大功率耗散:1 W
认证状态:Not Qualified最大重复峰值反向电压:50 V
最大反向电流:1000 µA反向测试电压:40 V
子类别:Other Diodes表面贴装:YES
技术:SCHOTTKY端子形式:J BEND
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

UC3610Q 数据手册

 浏览型号UC3610Q的Datasheet PDF文件第1页浏览型号UC3610Q的Datasheet PDF文件第3页浏览型号UC3610Q的Datasheet PDF文件第4页浏览型号UC3610Q的Datasheet PDF文件第5页浏览型号UC3610Q的Datasheet PDF文件第6页浏览型号UC3610Q的Datasheet PDF文件第7页 
UC1610  
UC3610  
SLUS339B − JUNE 1993 − REVISED DECEMBER 2004  
N OR J PACKAGE  
TOP VIEW  
DW PACKAGE  
TOP VIEW  
absolute maximum ratings over operating free-air temperature (unless otherwise noted)}  
Peak inverse voltage (per diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V  
Peak forward current  
UC1611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 A  
UC2610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 A  
UC3611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 A  
Power dissipation at T = 70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W  
A
Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
Consult packaging section of databook for thermal limitations and considerations of package.  
electrical characteristics, all specifications apply to each individual diode, TJ = 25°C, TA = TJ,  
(except as noted)  
PARAMETER  
Forward voltage drop  
TEST CONDITIONS  
MIN  
0.35  
0.8  
TYP  
0.5  
MAX UNITS  
I = 100 mA  
0.7  
1.3  
0.1  
1.0  
V
V
F
I = 1 A  
F
1.0  
0.01  
0.1  
15  
V
= 40 V  
= 40 V,  
mA  
mA  
ns  
ns  
pF  
R
R
Leakage current  
V
T = 100°C  
J
Reverse recovery  
Forward recovery  
Junction capacitance  
0.5 A forward to 0.5 A reverse  
1 A forward to 1.1 V recovery  
30  
V
R
= 5 V  
70  
NOTE: At forward currents of greater than 1.0 A, a parasitic current of approximately 10 mA may be collected by adjacent diodes.  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
2
www.ti.com  

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