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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| UC30-214164 | SICK |
获取价格 |
ULTRASONIC SENSORS |
|
| UC3-1 | TI |
获取价格 |
Fast LDO Linear Regulator |
|
| UC310 | MOTOROLA |
获取价格 |
FIELD-EFFECT TRANSISTORS DICE |
|
| UC310 | FREESCALE |
获取价格 |
FIELD-EFFECT TRANSISTORS DICE |
|
| UC-3100 | MOXA |
获取价格 |
Arm-based computing platform with wireless built in |
|
| UC-3101-T-AULX | MOXA |
获取价格 |
Arm-based computing platform with wireless built in |
|
| UC-3101-T-EULX | MOXA |
获取价格 |
Arm-based computing platform with wireless built in |
|
| UC-3101-T-USLX | MOXA |
获取价格 |
Arm-based computing platform with wireless built in |
|
| UC-3111-T-AULX | MOXA |
获取价格 |
Arm-based computing platform with wireless built in |
|
| UC-3111-T-EULX | MOXA |
获取价格 |
Arm-based computing platform with wireless built in |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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