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TXS0102

更新时间： 2024-11-25 03:25:43
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德州仪器 - TI /
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13页 262K
描述
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS

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TXS0102 数据手册

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TXS0102  
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR  
FOR OPEN-DRAIN APPLICATIONS  
www.ti.com  
SCES640–JANUARY 2007  
FEATURES  
DCT OR DCU PACKAGE  
(TOP VIEW)  
•
•
•
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
B1  
1
2
3
4
8
7
6
5
B2  
GND  
VCCA  
A2  
1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on  
B port (VCCA ≤ VCCB  
)
VCCB  
OE  
A1  
VCC Isolation Feature – If Either VCC Input Is at  
GND, Both Ports Are in the High-Impedance  
State  
•
•
•
Ioff Supports Partial-Power-Down Mode  
Operation  
YZP PACKAGE  
(BOTTOM VIEW)  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
D1  
C1  
B1  
A1  
D2  
C2  
B2  
A2  
4 5  
3 6  
2 7  
1 8  
A2  
A1  
ESD Protection Exceeds JESD 22  
VCCA  
OE  
–
A Port  
VCCB  
GND  
B2  
–
–
–
2500-V Human-Body Model (A114-B)  
B1  
250-V Machine Model (A115-A)  
1500-V Charged-Device Model (C101)  
abc  
abc  
abc  
abc  
–
B Port  
–
–
–
8-kV Human-Body Model (A114-B)  
250-V Machine Model (A115-A)  
1500-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This two-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to  
track VCCA. VCCA accepts any supply voltage from 1.65 V to 3.6 V. The B port is designed to track VCCB. VCCA  
must be less than or equal to VCCB. VCCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for  
low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.  
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.  
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a  
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the  
driver.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP  
Reel of 3000  
TXS0102YZPR  
Reel of 3000  
Tube of 250  
Reel of 3000  
TXS0102DCTR  
TXS0102DCTT  
TXS0102DCUR  
NFEZ_ _ _  
–40°C to 85°C  
SSOP – DCT  
NFEZ _ _ _  
_ _ NFE  
VSSOP – DCU  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...13

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TXS0102 替代型号

型号 品牌 替代类型 描述 数据表
SN74AVC2T245 TI

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