Datasheet > TSPC603PMGB/T8ME

TSPC603PMGB/T8ME

更新时间： 2024-11-28 15:55:11

品牌	Logo	应用领域
爱特美尔 - ATMEL		时钟外围集成电路
页数	文件大小	规格书
38页	704K
描述
RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

TSPC603PMGB/T8ME 技术参数

生命周期：	Obsolete	零件包装代码：	BGA
包装说明：	BGA,	针数：	255
Reach Compliance Code：	unknown	ECCN代码：	3A001.A.2.C
HTS代码：	8542.31.00.01	风险等级：	5.22
地址总线宽度：	32	位大小：	32
边界扫描：	YES	最大时钟频率：	66.67 MHz
外部数据总线宽度：	64	格式：	FLOATING POINT
集成缓存：	NO	JESD-30 代码：	S-CBGA-B255
长度：	21 mm	低功率模式：	YES
端子数量：	255	最高工作温度：	125 °C
最低工作温度：	-55 °C	封装主体材料：	CERAMIC, METAL-SEALED COFIRED
封装代码：	BGA	封装形状：	SQUARE
封装形式：	GRID ARRAY	认证状态：	Not Qualified
座面最大高度：	3.16 mm	速度：	200 MHz
最大供电电压：	2.625 V	最小供电电压：	2.375 V
标称供电电压：	2.5 V	表面贴装：	YES
技术：	CMOS	温度等级：	MILITARY
端子形式：	BALL	端子节距：	1.27 mm
端子位置：	BOTTOM	宽度：	21 mm
uPs/uCs/外围集成电路类型：	MICROPROCESSOR, RISC	Base Number Matches：	1

TSPC603PMGB/T8ME 数据手册

TSPC603p

PowerPC 603e RISC MICROPROCESSOR Family

PID7v-603e Specification

DESCRIPTION

The PID7v-603e implementation of PowerPC603e (after

named 603p) is a low-power implementation of reduced

instruction set computer (RISC) microprocessors PowerPC

family. The 603p implements 32-bit effective addresses, inte-

gerdatatypesof8, 16and32bits, andfloating-pointdatatypes

of 32 and 64 bits.

CERQUAD 240

The 603p is a low-power 2.5/3.3-volt design and provides four

software controllable power-saving modes.

The 603p is a superscalar processor capable of issuing and

retiring as many as three instructions per clock. Instructions

can execute out of order for increased performance ; however,

the 603p makes completion appear sequential. The 603p inte-

grates five execution units and is able to execute five instruc-

tions in parallel.

A suffix

CERQUAD 240

Ceramic Leaded Chip Carrier

The 603p provides independent on-chip, 16-Kbyte, four-way

set-associative, physically addressed caches for instructions

and data and on-chip instruction and data memory manage-

ment units (MMUs). The MMUs contain 64-entry, two-way set-

associative, data and instruction translation lookaside buffers

that provide support for demand-paged virtual memory

address translation and variable-sized block translation.

The 603p has a selectable 32 or 64-bit data bus and a 32-bit

address bus. The 603p interface protocol allows multiple mas-

ters to complete for system resources through a central exter-

nal arbiter. The 603p supports single-beat and burst data

transfers for memory accesses, and supports memory-

mapped I/O.

The 603p uses an advanced, 2.5/3.3-V CMOS process tech-

nology and maintains full interface compatibility with TTL devi-

ces.

The 603p integrates in system testability and debugging fea-

tures through JTAG boundary-scan capability.

MAIN FEATURES

G suffix

CBGA 255

Ceramic Ball Grid Array

(To be introduced)

H 4.0 SPECint95, 5.3 SPECfp95 @ 166 MHz (estimated)

H Superscalar (3 instructions per clock peak).

H Dual 16KB caches.

H Selectable bus clock.

H 32-bit compatibility PowerPC implementation.

H On chip debug support.

H P_Dtypical = 3.0 Watts (166 MHz), full operating conditions.

H Nap, doze and sleep modes for power savings.

H Branch folding.

SCREENING / QUALITY / PACKAGING

H 64-bit data bus (32-bit data bus option).

This product is manufactured in full compliance with :

H 4-Gbyte direct addressing range.

H MIL-STD-883 class B or According to TCS standards

H Pipelined single/double precision float unit.

(planned)

IEEE 754 compatible FPU.

H Upscreenings based upon TCS standards

H IEEE P 1149-1 test mode (JTAG/C0P).

H f_intmax = 166 MHz. (200 MHz planned).

H f_busmax = 66.67 MHz.

H Full military temperature range (T_c= -55°C, Tc= +125°C)

Industrial temperature range (T_c= –40°C, T_c= +110°C)

H Internal // I/O Power Supply = 2.5 ± 5 % // 3.3 V ± 5 %.

H 240 pin Cerquad or 255 pin CBGA packages

H Compatible CMOS input / TTL Output.

June 1998

1/38

12 3 4 5 6 7...38

中文翻译

下载PDF

与TSPC603PMGB/T8ME相关器件

型号	品牌	获取价格	描述	数据表
TSPC603PMGU/T6LE	ATMEL	获取价格	RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA240, CERAMIC, BGA-240
TSPC603PVA6LE	ATMEL	获取价格	RISC Microprocessor, 32-Bit, 166MHz, CMOS, CQFP240, CERQUAD-240
TSPC603PVAU/T6ME	ATMEL	获取价格	RISC Microprocessor, 32-Bit, 166MHz, CMOS, CQFP240, CERQUAD-240
TSPC603PVAU/T8ME	ATMEL	获取价格	RISC Microprocessor, 32-Bit, 200MHz, CMOS, CQFP240, CERQUAD-240
TSPC603PVAU6LE	ATMEL	获取价格	RISC Microprocessor, 32-Bit, 166MHz, CMOS, CQFP240, CERQUAD-240
TSPC603PVAU6ME	ATMEL	获取价格	RISC Microprocessor, 32-Bit, 166MHz, CMOS, CQFP240, CERQUAD-240
TSPC603PVAU8ME	ATMEL	获取价格	RISC Microprocessor, 32-Bit, 200MHz, CMOS, CQFP240, CERQUAD-240
TSPC603PVG8LE	ATMEL	获取价格	RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH,
TSPC603PVG8ME	ATMEL	获取价格	RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH,
TSPC603PVGU/T6ME	ATMEL	获取价格	RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH,

与TSPC603PMGB/T8ME相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

47
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

37
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

65
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

61

产品中心

服务支持

精选活动

关于我们

帮助中心

TSPC603PMGB/T8ME

TSPC603PMGB/T8ME 技术参数

TSPC603PMGB/T8ME 数据手册

与TSPC603PMGB/T8ME相关器件

与TSPC603PMGB/T8ME相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

TSPC603PMGB/T8ME

TSPC603PMGB/T8ME 技术参数

TSPC603PMGB/T8ME 数据手册

与TSPC603PMGB/T8ME相关器件

与TSPC603PMGB/T8ME相关文章

您还可以找

您在本页遇到什么问题？