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TSB82AA2ZGW PDF预览

TSB82AA2ZGW

更新时间： 2024-02-23 09:17:42
品牌 Logo 应用领域
德州仪器 - TI 通信时钟数据传输PC外围集成电路
页数 文件大小 规格书
3页 44K
描述
High Performance 1394b 3.3V OHCI 1.1+ Compliant Link Layer Controller 176-BGA MICROSTAR 0 to 70

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TSB82AA2ZGW 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：BGA包装说明：LFBGA, BGA176,17X17,32
针数：176Reach Compliance Code：compliant
HTS代码：8542.31.00.01Factory Lead Time：1 week
风险等级：5.73其他特性：ALSO REQUIRES 5V SUPPLY
地址总线宽度：64边界扫描：NO
总线兼容性：PCI最大时钟频率：33 MHz
通信协议：IEEE1394B最大数据传输速率：100 MBps
外部数据总线宽度：64JESD-30 代码：S-PBGA-B176
JESD-609代码：e1长度：15 mm
低功率模式：YES湿度敏感等级：3
I/O 线路数量：2串行 I/O 数：1
端子数量：176最高工作温度：70 °C
最低工作温度：封装主体材料：PLASTIC/EPOXY
封装代码：LFBGA封装等效代码：BGA176,17X17,32
封装形状：SQUARE封装形式：GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）：260电源：3.3,3.3/5 V
认证状态：Not Qualified座面最大高度：1.4 mm
子类别：Bus Controllers最大供电电压：3.6 V
最小供电电压：3 V标称供电电压：3.3 V
表面贴装：YES技术：CMOS
温度等级：COMMERCIAL端子面层：Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：BALL端子节距：0.8 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：15 mmuPs/uCs/外围集成电路类型：SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches：1

TSB82AA2ZGW 数据手册

 浏览型号TSB82AA2ZGW的Datasheet PDF文件第2页浏览型号TSB82AA2ZGW的Datasheet PDF文件第3页 
TSB82AA2  
www.ti.com  
SLLA221–JUNE 2006  
1394b OHCI-Lynx Controller  
FEATURES  
•
PCI burst transfers and deep FIFOs to  
tolerate large host latency:  
•
Single 3.3-V supply (1.8-V internal core  
voltage with regulator)  
– Transmit FIFO—5K asynchronous  
– Transmit FIFO—2K isochronous  
– Receive FIFO—2K asynchronous  
– Receive FIFO—2K isochronous  
•
•
3.3-V and 5-V PCI signaling environments  
Serial bus data rates of 100M bits/s, 200M  
bits/s, 400M bits/s, and 800M bits/s  
•
•
•
•
Physical write posting of up to three  
outstanding transactions  
•
•
D0, D1, D2, and D3 power states and PME  
events per the PCI Bus Power Management  
Interface Specification  
Serial ROM or boot ROM interface supports  
2-wire serial EEPROM devices  
Programmable asynchronous transmit  
threshold  
33-MHz/64-bit and 33-MHz/32-bit selectable  
PCI interface  
•
•
Isochronous receive dual-buffer mode  
Multifunction terminal (MFUNC terminal 1):  
Out-of-order pipelining for asynchronous  
transmit requests  
– PCI_CLKRUN protocol per the PCI Mobile  
Design Guide  
•
•
•
•
•
Register access fail interrupt when the PHY  
SYSCLK is not active  
– General-purpose I/O  
– CYCLEIN/CYCLEOUT for external cycle  
timer control for customized  
synchronization  
Initial bandwidth available and initial  
channels available registers  
Digital video and audio performance  
enhancements  
Fabricated in advanced low-power CMOS  
process  
Packaged in 144-terminal LQFP (PGE) or  
176-ball MicroStar BGA (GGW)  
DESCRIPTION  
The TSB82AA2 OHCI-Lynx is a discrete 1394b link-layer device, which has been designed to meet the  
demanding requirements of today’s 1394 bus designs. The TSB82AA2 device is capable of exceptional 800M  
bits/s performance; thus, providing the throughput and bandwidth to move data efficiently and quickly between  
the PCI and 1394 buses. The TSB82AA2 device also provides outstanding ultra-low power operation and  
intelligent power management capabilities. The device provides the IEEE 1394 link function and is compatible  
with 100M bits/s, 200M bits/s, 400M bits/s, and 800M bits/s serial bus data rates.  
The TSB82AA2 improved throughput and increased bandwidth make it ideal for today’s high-end PCs and open  
the door for the development of S800 RAID- and SAN-based peripherals.  
The TSB82AA2 OHCI-Lynx operates as the interface between a 33-MHz/64-bit or 33-MHz/32-bit PCI local bus  
and a compatible 1394b PHY-layer device (such as the TSB81BA3 device) that is capable of supporting serial  
data rates at 98.304M, 196.608M, 393.216M, or 786.432M bits/s (referred to as S100, S200, S400, or S800  
speeds, respectively). When acting as a PCI bus master, the TSB82AA2 device is capable of multiple cacheline  
bursts of data, which can transfer at 264M bytes/s for 64-bit transfers or 132M bytes/s for 32-bit transfers after  
connecting to the memory controller.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
123

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