Datasheet > TS3A26746E_14

TS3A26746E_14

更新时间： 2024-11-02 02:58:27

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
8页	463K
描述
2 X 2 Crosspoint Switch for Audio Applications

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

TS3A26746E_14 数据手册

TS3A26746E

www.ti.com

SCDS313B –FEBRUARY 2011–REVISED NOVEMBER 2011

2 X 2 Crosspoint Switch for Audio Applications

Check for Samples: TS3A26746E

FEATURES

PINOUT

•

Ultra Low R_ONfor GND Switch (80-mΩ typical)

R_ONfor MIC Switch <10-Ω

3.0V to 3.6V V+ Operation

Control Input is 1.8-V Logic Compatible

6-bump, 0.5mm pitch CSP Package (1.45mm ×

0.95mm × 0.5mm)

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

ESD Performance Tested Per JESD 22

DESCRIPTION

–

2000-V Human-Body Model (A114-B, Class

II)

The TS3A26746E is a 2 × 2 cross-point switch that is

used to interchange the Ground and MIC connections

on a headphone connector. The Ground switch has

an ultra low R_ONof <0.1Ω to minimize voltage drop

across it, preventing undesired increases in

headphone ground reference voltage. The switch

state is controlled via the SEL input. When

SEL=High, GND is connected to RING2 and MIC is

connected to SLEEVE. When SEL=Low, GND is

connected to SLEEVE and MIC is connected to

RING2. An internal 100k pull-up resistor on the SEL

input sets the default state of the switch.

–

500-V Charged-Device Model (C101)

•

ESD Performance (SLEEVE, RING2)

±8-kV Contact Discharge (IEC 61000-4-2)

–

APPLICATIONS

•

Cellular phones

PDAs

Portable Instrumentation

Digital Still Cameras

Portable Navigation Devices

ORDERING INFORMATION

T_A

PACKAGE⁽¹⁾

ORDERABLE PART NUMBER

TOP-SIDE MARKING

–40°C to 85°C

YZP - WCSP Tape and Reel

TS3A26746EYZPR

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

12 3 4 5 6 7 8

中文翻译

下载PDF

与TS3A26746E_14相关器件

型号	品牌	获取价格	描述	数据表
TS3A26746EYZPR	TI	获取价格	2 X 2 Crosspoint Switch for Audio Applications
TS3A27518E	TI	获取价格	6-BIT, 1-of-2 MULTIPLEXER/DEMULTIPLEXER WITH INTEGRATED IEC L-4 ESD AND 1.8-V LOGIC COMPAT
TS3A27518E_16	TI	获取价格	6-Channel, 1:2 Multiplexer/Demultiplexer
TS3A27518EIPWRQ1	TI	获取价格	6-BIT, 1-of-2 MULTIPLEXER/DEMULTIPLEXER WITH INTEGRATED IEC L-4 ESD AND 1.8-V LOGIC COMPAT
TS3A27518EIRTWRQ1	TI	获取价格	6-BIT, 1-of-2 MULTIPLEXER/DEMULTIPLEXER WITH INTEGRATED IEC L-4 ESD AND 1.8-V LOGIC COMPAT
TS3A27518EPWR	TI	获取价格	6-BIT, 1-of-2 MULTIPLEXER/DEMULTIPLEXER WITH INTEGRATED IEC L-4 ESD AND 1.8-V LOGIC COMPAT
TS3A27518E-Q1	TI	获取价格	6-BIT, 1-of-2 MULTIPLEXER/DEMULTIPLEXER WITH INTEGRATED IEC L-4 ESD AND 1.8-V LOGIC COMPAT
TS3A27518ERTWR	TI	获取价格	6-BIT, 1-of-2 MULTIPLEXER/DEMULTIPLEXER WITH INTEGRATED IEC L-4 ESD AND 1.8-V LOGIC COMPAT
TS3A27518ETRTWRQ1	TI	获取价格	6-BIT, 1-of-2 MULTIPLEXER/DEMULTIPLEXER WITH INTEGRATED IEC L-4 ESD AND 1.8-V LOGIC COMPAT
TS3A27518EZQSR	TI	获取价格	6-BIT, 1-of-2 MULTIPLEXER/DEMULTIPLEXER WITH INTEGRATED IEC L-4 ESD AND 1.8-V LOGIC COMPAT

与TS3A26746E_14相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

4
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

2
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

23
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

24

产品中心

服务支持

精选活动

关于我们

帮助中心

TS3A26746E_14

TS3A26746E_14 数据手册

与TS3A26746E_14相关器件

与TS3A26746E_14相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

TS3A26746E_14

TS3A26746E_14 数据手册

与TS3A26746E_14相关器件

与TS3A26746E_14相关文章

您还可以找

您在本页遇到什么问题？