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TS3A44159TD2

更新时间： 2024-11-24 01:09:11
品牌 Logo 应用领域
德州仪器 - TI 光电二极管输出元件
页数 文件大小 规格书
6页 66K
描述
TS3A44159-DIE Quad SPDT Analog Switch Quad-Channel 2:1 Multiplexer/Demultiplexer With Two Controls

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中文翻译

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TS3A44159TD2 技术参数

是否Rohs认证： 不符合生命周期：Active
包装说明：DIE,Reach Compliance Code：not_compliant
Factory Lead Time：6 weeks风险等级：5.82
模拟集成电路 - 其他类型：SPDT标称带宽：35 MHz
JESD-30 代码：R-XUUC-N20正常位置：NO/NC
信道数量：4功能数量：4
端子数量：20输出：SEPARATE OUTPUT
封装主体材料：UNSPECIFIED封装代码：DIE
封装形状：RECTANGULAR封装形式：UNCASED CHIP
峰值回流温度（摄氏度）：NOT SPECIFIED最大供电电流 (Isup)：0.00075 mA
表面贴装：YES切换：BREAK-BEFORE-MAKE
端子形式：NO LEAD端子位置：UPPER
处于峰值回流温度下的最长时间：NOT SPECIFIEDBase Number Matches：1

TS3A44159TD2 数据手册

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Sample &  
Buy  
Support &  
Community  
Product  
Folder  
Tools &  
Software  
Technical  
Documents  
TS3A44159-DIE  
SCDS354 –FEBRUARY 2014  
TS3A44159-DIE Quad SPDT Analog Switch Quad-Channel 2:1 Multiplexer/Demultiplexer  
With Two Controls  
1 Features  
3 Description  
The TS3A44159-DIE is a quad single-pole double-  
throw (SPDT) analog switch with two control inputs.  
This device is also known as a dual double-pole  
double-throw (DPDT) configuration. It offers low ON-  
state resistance and excellent ON-state resistance  
matching with the break-before-make feature, to  
prevent signal distortion during the transferring of a  
signal from one channel to another. The device has  
an excellent total harmonic distortion (THD)  
performance and consumes very low power. These  
features make this device suitable for portable audio  
applications.  
1
•
•
•
•
•
Specified Break-Before-Make Switching  
Low ON-State Resistance  
Low Charge Injection  
Excellent ON-State Resistance Matching  
Low Total Harmonic Distortion (THD)  
2 Applications  
•
•
•
•
•
•
•
•
•
•
Cell Phones  
PDAs  
Portable Instrumentation  
Audio and Video Signal Routing  
Low-Voltage Data-Acquisition Systems  
Communication Circuits  
Modems  
Hard Drives  
Computer Peripherals  
Wireless Terminals and Peripherals  
Ordering Information(1)  
PACKAGE  
PRODUCT  
PACKAGE  
ORDERABLE PART NUMBER  
PACKAGE QUANTITY  
DESIGNATOR  
TS3A44159TD1  
TS3A44159TD2  
221  
10  
TS3A44159  
TD  
Bare die in waffle pack(2)  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality  
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room  
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not  
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
123456

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