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TS1909CX550 PDF预览

TS1909CX550

更新时间: 2024-11-06 01:08:35
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页数 文件大小 规格书
6页 311K
描述
MicroPower VFM Boost DC to Dc Converter

TS1909CX550 数据手册

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TS1909  
MicroPower VFM Boost DC to Dc Converter  
SOT-25  
Pin Definition:  
1. Enable  
2. Output  
3. N.C  
4. Ground  
5. SW  
General Description  
The TS1909 is a high efficiency VFM Step-up DC/DC converter for small, low input voltage or battery powered  
systems with ultra low quiescent supply current. The TS1909 accept a positive input voltage from start-up voltage to  
VOUT and convert it to a higher output voltage in the 2.5 to 5V range.  
The TS1909 combine ultra low quiescent supply current and high efficiency to give maximum battery life. The high  
switching frequency and the internally limited peak inductor current permits the use of small, low cost inductors. Only  
three external components are needed an inductor a diode and an output capacitor. The TS1909 is suitable to be  
used in battery powered equipment where low noise, low ripple and ultra low supply current are required.  
Typical applications are pagers, cameras & video camera, cellular telephones, wireless telephones, palmtop  
computer, battery backup supplies, battery powered equipment.  
Features  
Typical Application Circuit  
Very Low Supply Current 22µA (Typ.)  
Maximum shutdown current <1µA  
Output Voltage Accuracy ±2.5%  
Output Current up to 100mA  
Low Ripple and Low Noise  
Very Low Start-up Voltage  
High Efficiency Typ. 87% @ VOUT=5V  
Few External Components  
Ordering Information  
Part No.  
Package  
SOT-25  
Packing  
TS1909CX5xx RF  
3Kpcs / 7” Reel  
Note: Where xx denotes voltage option.  
Available output: 27=2.7V, 30=3V, 33=3.3V, 50=5V  
Absolute Maximum Rating  
Parameter  
Symbol  
VIN  
Limit  
5.5  
Unit  
V
VIN Pin Voltage  
SW Voltage  
VSW  
VOUT  
TSTG  
TJ  
5.5  
V
OUT Pin Voltage  
5.5  
V
oC  
oC  
Storage Temperature Range  
Operating Junction Temperature Range  
Power Dissipation  
-40 to +150  
-20 to +100  
( TJ-TA ) / θJA  
110  
PD  
mW  
oC/W  
oC/W  
Thermal Resistance from Junction to case  
Thermal Resistance from Junction to ambient  
θJC  
θJA  
250  
Note: θJA is measured with the PCB copper area of approximately 1 inch (Multi-layer) that need connect to GND pin.  
1/1  
Version: A10  

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