TPD2EUSB30, TPD4EUSB30
www.ti.com
SLVSAC2 –AUGUST 2010
2, 4-CHANNEL ESD SOLUTION FOR SUPER-SPEED (6 GBPS) USB 3.0 INTERFACE
Check for Samples: TPD2EUSB30, TPD4EUSB30
1
FEATURES
TPD2EUSB30DRTR PACKAGE
(TOP VIEW)
•
Single and Dual-Pair Differential Lines to
Protect the Differential Data and Clock Lines of
the USB3.0, eSATA, or LVD Interface
1
D+
3
•
Flow-Through Pin Mapping for the High-Speed
Lines Ensures Zero Additional Skew Due to
Board Layout While Placing ESD-Protection
Chip Near the Connector
GND
2
D–
TPD4EUSB30DQAR PACKAGE
(TOP VIEW)
•
•
Supports Data Rates in Excess of 6 Gbps
ESD Protection Meets or Exceeds
IEC61000-4-2 (Level 4)
1
2
3
4
5
10
9
D1+
D1–
GND
D2+
D2–
N.C.
N.C.
GND
N.C.
N.C.
•
•
•
•
Low Capacitance 0.05pF (IO to IO)
5-A Peak Pulse Current (per 8/20 ms Pulse)
Industrial Temperature Range: –40°C to 85°C
Space-Saving DRT, DQA Packages
8
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APPLICATIONS
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•
•
•
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Notebooks
Set-Top Boxes
DVD Players
Media Players
Portable Computers
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DESCRIPTION/ORDERING INFORMATION
The TPD2EUSB30 and TPD4EUSB30 provide 2 and 4 channel ESD clamp circuits with flow-through pin
mapping for ease of board layout. These devices have been designed to protect sensitive components which are
connected to ultra high-speed data and transmission lines. The TPDxEUSB30 offer protection from stress
caused by ESD (electrostatic discharge). These devices also offer 5 A (8/20 ms) peak pulse current ratings per
IEC 61000-4-5 (lightning) specification.
The monolithic silicon technology allows matching between the differential signal pairs. The differential 0.05-pF
capacitance ensures that the signal distortion due to added ESD clamp remains minimal at high-speed
differential data transmission.
The TPD2EUSB30 and TPD4EUSB30 conform to IEC61000-4-2 (Level 4) ESD protection. The TPD2EUSB30 is
offered in space saving DRT (1 mm × 1 mm) package. The TPD4EUSB30 is offered in space saving DQA (1 mm
× 2.5 mm) package.
The TPD2EUSB30 and TPD4EUSB30 are characterized for operation over ambient air temperature range of
–40°C to 85°C.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.