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TPD2S017DBVR

更新时间： 2024-11-19 05:55:03
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德州仪器 - TI 分离技术隔离技术
页数 文件大小 规格书
10页 417K
描述
2-CHANNEL ULTRA-LOW CLAMP VOLTAGE ESD SOLUTION WITH SERIES-RESISTOR ISOLATION

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中文翻译

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TPD2S017DBVR 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：R-PDSO-G6
针数：6Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8542.39.00.01
Factory Lead Time：6 weeks风险等级：1.76
Samacsys Description：TEXAS INSTRUMENTS - TPD2S017DBVR . - ESD Protection Device, SOT-23, 6 Pins, 463.18 mW, TPD2S Series最小击穿电压：11 V
击穿电压标称值：12 V最大钳位电压：14 V
配置：COMPLEX二极管元件材料：SILICON
二极管类型：TRANS VOLTAGE SUPPRESSOR DIODEJESD-30 代码：R-PDSO-G6
JESD-609代码：e3湿度敏感等级：1
元件数量：4端子数量：6
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：SMALL OUTLINE峰值回流温度（摄氏度）：260
极性：UNIDIRECTIONAL最大功率耗散：0.463 W
认证状态：Not Qualified最大重复峰值反向电压：5 V
子类别：Transient Suppressors表面贴装：YES
技术：AVALANCHE端子面层：Matte Tin (Sn)
端子形式：GULL WING端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED

TPD2S017DBVR 数据手册

 浏览型号TPD2S017DBVR的Datasheet PDF文件第2页浏览型号TPD2S017DBVR的Datasheet PDF文件第3页浏览型号TPD2S017DBVR的Datasheet PDF文件第4页浏览型号TPD2S017DBVR的Datasheet PDF文件第5页浏览型号TPD2S017DBVR的Datasheet PDF文件第6页浏览型号TPD2S017DBVR的Datasheet PDF文件第7页 
TPD2S017  
www.ti.com .......................................................................................................................................................................................... SLLS949–SEPTEMBER 2009  
2-CHANNEL ULTRA-LOW CLAMP VOLTAGE ESD SOLUTION  
WITH SERIES-RESISTOR ISOLATION  
1
FEATURES  
APPLICATIONS  
•
•
•
•
Hi-Speed USB  
IEEE 1394 Interface  
Low-Voltage Differential Signaling (LVDS)  
Mobile Display Digital Interface (MDDI)/Mobile  
Industry Processor Interface (MIPI)  
•
Ultra-Low Clamp Voltage Ensures the  
Protection of Ultra-Low Voltage Core Chipset  
During ESD Events  
•
•
•
•
•
•
Exceeds ESD Protection to IEC61000-4-2  
(Level 4)  
•
HS Signal  
Matching of Series Resistor (R =1 Ω) of ±8 mΩ  
(Typical)  
DBV PACKAGE  
(TOP VIEW)  
Differential Channel Input Capacitance  
Matching of 0.02 pF (Typical)  
High-Speed Data Rate and EMI Filter Action at  
High Frequencies (–3 dB Bandwidth, ≈3 GHz)  
Ch1_Out  
GND  
1
2
3
6
5
4
Ch2_Out  
Available in 6-Pin Small-Outline Transistor  
[SOT (DBV)] Package  
V
CC  
Flow-Through Single-In-Line Pin Mapping for  
the High-Speed Lines Ensures no Additional  
Board Layout Burden While Placing the ESD  
Protection Chip Near the Connector  
Ch1_In  
Ch2_In  
DESCRIPTION/ORDERING INFORMATION  
The TPD2S017 provides a robust system-level ESD solution for the high-speed lines interfacing low-voltage,  
ESD-sensitive core chipset. This device offers two stage ESD clamps in each line with ≈1-Ω series resistor  
isolation. This architecture allows the device to generate very low clamp voltage during system level ESD strikes.  
Due to the series resistor component, the TPD2S017 provides a controlled filter roll-off for even greater spurious  
EMI suppression and signal integrity. This device offers a flow-through pin mapping for ease of board layout. The  
monolithic silicon technology allows matching component values, including clamp capacitance, series resistor  
matching, etc., between the differential signal pairs. Tight matching of the line capacitance and series resistors  
ensure that the differential signal distortion due to added ESD clamp remains minimal, and also allow the part to  
operate at high-speed differential data rate (in excess of 1.5 Gbps).  
The TPD2S017 confirms the IEC61000-4-2 (Level 4) ESD protection and ±15 kV HBM ESD protection. This  
device is offered in space saving DBV packages.  
The TPD2S017 is characterized for operation over ambient air temperature of –40°C to 85°C.  
ORDERING INFORMATION  
TA  
PACKAGE(1)(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
NFTF  
–40°C to 85°C  
SOT (SOT-23) – DBV  
Reel of 3000  
TPD2S017DBVR  
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2009, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...10

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