TPD2EUSB30
www.ti.com
SLVSA12 –NOVEMBER 2009
2-CHANNEL ESD SOLUTION FOR SUPER-SPEED (6 GBPS) USB 3.0 INTERFACE
Check for Samples: TPD2EUSB30
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FEATURES
APPLICATIONS
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•
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Notebooks
Set-Top Boxes
DVD Players
Media Players
Portable Computers
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0.05-pF Matching Capacitance Between the
Differential Signal Pair
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Single-Pair Differential Lines to Protect the
Differential Data and Clock Lines of the
USB3.0, eSATA, or LVD Interface
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Flow-Through Pin Mapping for the High-Speed
Lines Ensures Zero Additional Skew Due to
Board Layout While Placing ESD-Protection
Chip Near the Connector
DRT PACKAGE
(TOP VIEW)
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D+
D–
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Supports Data Rates in Excess of 6 Gbps
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GND
ESD Protection Meets or Exceeds
IEC61000-4-2 (Level 4)
2
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5-A Peak Pulse Current (8/20 μs Pulse) for D+,
D– Lines
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Industrial Temperature Range: –40°C to 85°C
Space-Saving DRT Package
DESCRIPTION/ORDERING INFORMATION
The TPD2EUSB30 provides 2 ESD clamp circuits with flow-through pin mapping for ease of board layout. This
device has been designed to protect sensitive components which are connected to ultra high-speed data and
transmission lines. The TPD2EUSB30 offers protection from stress caused by ESD (electrostatic discharge). This
device also offers 5 A (8/20 μs) peak pulse current ratings per IEC 61000-4-5 (lightning) specification.
The monolithic silicon technology allows matching between the differential signal pairs. The less than differential
0.05-pF capacitance ensures that the differential signal distortion due to added ESD clamp remains minimal. The
0.7-pF line capacitance is suitable for high-speed data rate (in excess of 6 Gbps).
The TPD2EUSB30 conforms to IEC61000-4-2 (Level 4) ESD protection. The TPD2EUSB30 is offered in space
saving DRT (1 mm × 1 mm) package.
The TPD2EUSB30 is characterized for operation over ambient air temperature range of –40°C to 85°C.
ORDERING INFORMATION
TA
PACKAGE(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
5PX
–40°C to 85°C
SOT (3-DRT)
Tape and reel
TPD2EUSB30DRTR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.