TPD2EUSB30, TPD2EUSB30A, TPD4EUSB30
www.ti.com
SLVSAC2A –AUGUST 2010–REVISED DECEMBER 2010
2, 4-CHANNEL PROTECTION SOLUTION FOR SUPER-SPEED (6 GBPS) USB 3.0
INTERFACE
Check for Samples: TPD2EUSB30, TPD2EUSB30A, TPD4EUSB30
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FEATURES
DRT PACKAGE
(TOP VIEW)
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Single and Dual-Pair Differential Lines to
Protect the Differential Data and Clock Lines of
the USB3.0, eSATA, or LVD Interface
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D+
D–
3
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Flow-Through Pin Mapping for the High-Speed
Lines Ensures near Zero Additional Skew Due
to Board Layout While Placing Protection Chip
Near the Connector
GND
2
DQA PACKAGE
(TOP VIEW)
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Supports Data Rates in Excess of 6 Gbps
ESD Protection Meets or Exceeds
IEC61000-4-2 (Level 4)
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2
3
4
5
10
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D1+
D1–
GND
D2+
D2–
N.C.
N.C.
GND
N.C.
N.C.
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•
•
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Low Capacitance 0.05pF (IO to IO)
1 Ω Dynamic Resistance
5-A Peak Pulse Current (per 8/20 ms Pulse)
Industrial Temperature Range: –40°C to 85°C
Space-Saving DRT, DQA Packages
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APPLICATIONS
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Notebooks
Set-Top Boxes
DVD Players
Media Players
Portable Computers
DESCRIPTION/ORDERING INFORMATION
The TPD2EUSB30, TPD2EUSB30A, and TPD4EUSB30 provide 2 and 4 channel ESD and surge protection
solutions in space saving, flow-through packages. These devices have been designed to protect sensitive
components which are connected to ultra high-speed data and transmission lines. These devices also offer 5 A
(8/20 ms) peak pulse current ratings per IEC 61000-4-5 (lightning) specification.
The monolithic silicon technology allows matching between the differential signal pairs. The differential 0.05-pF
capacitance ensures that the signal distortion due to added ESD clamp remains minimal at high-speed
differential data transmission.
The TPD2EUSB30A offers low 4.5V dc break-down voltage. The low capacitance and break-down voltage,
coupled low dynamic resistance, make the TPD2EUSB30A a superior ESD/ surge protection device for
high-speed differential IOs based off ultra-low voltage process nodes.
The TPD2EUSB30 and TPD2EUSB30A are offered in space saving DRT (1 mm × 1 mm) package. The
TPD4EUSB30 is offered in space saving DQA (1 mm × 2.5 mm) package. These devices are characterized for
operation over ambient air temperature range of –40°C to 85°C.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.