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TPC8A04-H(TE12L,Q) PDF预览

TPC8A04-H(TE12L,Q)

更新时间: 2024-10-02 20:06:27
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
8页 218K
描述
MOSFET N-CH SBD 18A SOP8 2-6J1B

TPC8A04-H(TE12L,Q) 技术参数

是否Rohs认证: 符合生命周期:End Of Life
包装说明:,Reach Compliance Code:unknown
风险等级:5.72配置:Single
最大漏极电流 (Abs) (ID):18 AFET 技术:METAL-OXIDE SEMICONDUCTOR
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):1.9 W
子类别:FET General Purpose Power表面贴装:YES
Base Number Matches:1

TPC8A04-H(TE12L,Q) 数据手册

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TPC8A04-H  
TOSHIBA Field Effect Transistor with Built-in Schottky Barrier Diode  
Silicon N-Channel MOS Type (U-MOS V-H)  
TPC8A04-H  
High Efficiency DC-DC Converter Applications  
Notebook PC Applications  
Unit: mm  
Portable Equipment Applications  
Built-in schottky barrier diode  
Low forward voltage: V  
High-speed switching  
= 0.6 V (max)  
DSF  
Small gate charge: Q  
= 13 nC (typ.)  
SW  
Low drain-source ON-resistance: R  
= 2.6 mΩ (typ.)  
DS (ON)  
High forward transfer admittance: |Y | = 62 S (typ.)  
fs  
Low leakage current: I  
= 100 μA (max) (V  
= 30 V)  
DSS  
DS  
Enhancement mode: V = 1.3 to 2.3 V (V  
= 10 V, I = 1 mA)  
D
th  
DS  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristic  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
30  
30  
V
V
V
DSS  
V
Drain-gate voltage (R  
Gate-source voltage  
= 20 kΩ)  
DGR  
GS  
JEDEC  
JEITA  
V
±20  
18  
GSS  
DC  
(Note 1)  
I
D
Drain current  
A
Pulsed (Note 1)  
I
72  
TOSHIBA  
2-6J1B  
DP  
Drain power dissipation  
Drain power dissipation  
(t = 10 s)  
(Note 2a)  
(t = 10 s)  
(Note 2b)  
Weight: 0.085g (typ.)  
P
1.9  
1.0  
W
W
D
D
P
Circuit Configuration  
Single-pulse avalanche energy  
(Note 3)  
E
211  
18  
mJ  
A
AS  
8
7
6
5
Avalanche current  
I
AR  
Repetitive avalanche energy  
E
0.082  
mJ  
AR  
(Tc = 25) (Note 4)  
T
T
150  
°C  
°C  
Channel temperature  
ch  
55 to 150  
Storage temperature range  
stg  
1
2
3
4
Note: For Notes 1 to 4, refer to the next page.  
Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in temperature, etc.) may cause this product to  
decrease in the reliability significantly even if the operating conditions (i.e. operating  
temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate  
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating  
Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).  
This transistor is an electrostatic-sensitive device. Handle with care.  
1
2010-04-20  

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