TPA751
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
WITH DIFFERENTIAL INPUTS
SLOS336C – DECEMBER 2000 – REVISED OCTOBER 2002
D OR DGN PACKAGE
D
D
Fully Specified for 3.3-V and 5-V Operation
(TOP VIEW)
Wide Power Supply Compatibility
2.5 V – 5.5 V
SHUTDOWN
BYPASS
IN+
V –
O
GND
1
2
3
4
8
7
6
5
D
D
D
Power Supply Rejection at 217 Hz
– 84 dB at V
– 81 dB at V
= 5 V
= 3.3 V
DD
DD
V
DD
IN–
V +
O
Output Power for R = 8 Ω
L
– 700 mW at V
– 250 mW at V
= 5 V
MicroStar Juniort (GQS) Package
DD
DD
= 3.3 V
(TOP VIEW)
Ultralow Supply Current in Shutdown
Mode . . . 1.5 nA
(E2)
(E3)
(E4)
(E5)
(A2)
V
GND
V
V
–
SHUTDOWN
BYPASS
IN+
O
(A3)
(A4)
(A5)
D
Thermal and Short-Circuit Protection
DD
+
IN–
O
D
Surface-Mount Packaging
– SOIC
– PowerPAD MSOP
– MicroStar Junior (BGA)
(SIDE VIEW)
NOTE: The shaded terminals are used for thermal
connections to the ground plane.
description
The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications
where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of
continuous power into a BTL 8-Ω load at less than 0.6% THD+N throughout voice band frequencies. Although
this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as
wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the
output in most applications, which is particularly important for small battery-powered equipment. This device
features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown.
The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior (BGA), 8-pin SOIC surface-mount package and
a surface-mount PowerPAD MSOP.
V
6
5
DD
V
R
DD
F
V
DD
/2
Audio
Input
C
S
R
I
IN –
IN+
4
3
V
+
O
–
+
C
I
2
BYPASS
C
B
700 mW
–
+
V
–
8
7
O
GND
SHUTDOWN
1
Bias
Control
From System Control
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD and MicroStar Junior are trademarks of Texas Instruments.
Copyright 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265