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TPA751GQS

更新时间： 2024-11-26 22:09:47
品牌 Logo 应用领域
德州仪器 - TI 商用集成电路放大器功率放大器低压音频输入元件
页数 文件大小 规格书
23页 361K
描述
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER WITH DIFFERENTIAL INPUTS

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TPA751GQS 技术参数

生命周期：Obsolete零件包装代码：BGA
包装说明：3 X3 MM, BGA-24针数：24
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8542.33.00.01风险等级：5.66
Is Samacsys：N其他特性：DEVICE FEATURES SHUTDOWN MODE FOR POWER SENSITIVE APPLICATIONS
标称带宽：20 kHz商用集成电路类型：AUDIO AMPLIFIER
谐波失真：0.5%JESD-30 代码：S-PBGA-B24
JESD-609代码：e0长度：3 mm
信道数量：1功能数量：1
端子数量：24最高工作温度：85 °C
最低工作温度：-40 °C标称输出功率：0.35 W
封装主体材料：PLASTIC/EPOXY封装代码：BGA
封装等效代码：BGA24,5X5,20封装形状：SQUARE
封装形式：GRID ARRAY电源：3.3/5 V
认证状态：Not Qualified座面最大高度：1 mm
子类别：Audio/Video Amplifiers最大压摆率：3 mA
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：2.5 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子面层：TIN LEAD
端子形式：BALL端子节距：0.5 mm
端子位置：BOTTOM宽度：3 mm
Base Number Matches：1

TPA751GQS 数据手册

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TPA751  
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER  
WITH DIFFERENTIAL INPUTS  
SLOS336C – DECEMBER 2000 – REVISED OCTOBER 2002  
D OR DGN PACKAGE  
D
D
Fully Specified for 3.3-V and 5-V Operation  
(TOP VIEW)  
Wide Power Supply Compatibility  
2.5 V – 5.5 V  
SHUTDOWN  
BYPASS  
IN+  
V –  
O
GND  
1
2
3
4
8
7
6
5
D
D
D
Power Supply Rejection at 217 Hz  
– 84 dB at V  
– 81 dB at V  
= 5 V  
= 3.3 V  
DD  
DD  
V
DD  
IN–  
V +  
O
Output Power for R = 8 Ω  
L
– 700 mW at V  
– 250 mW at V  
= 5 V  
MicroStar Juniort (GQS) Package  
DD  
DD  
= 3.3 V  
(TOP VIEW)  
Ultralow Supply Current in Shutdown  
Mode . . . 1.5 nA  
(E2)  
(E3)  
(E4)  
(E5)  
(A2)  
V
GND  
V
V
–
SHUTDOWN  
BYPASS  
IN+  
O
(A3)  
(A4)  
(A5)  
D
Thermal and Short-Circuit Protection  
DD  
+
IN–  
O
D
Surface-Mount Packaging  
– SOIC  
– PowerPAD MSOP  
– MicroStar Junior (BGA)  
(SIDE VIEW)  
NOTE: The shaded terminals are used for thermal  
connections to the ground plane.  
description  
The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications  
where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of  
continuous power into a BTL 8-Ω load at less than 0.6% THD+N throughout voice band frequencies. Although  
this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as  
wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the  
output in most applications, which is particularly important for small battery-powered equipment. This device  
features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown.  
The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior (BGA), 8-pin SOIC surface-mount package and  
a surface-mount PowerPAD MSOP.  
V
6
5
DD  
V
R
DD  
F
V
DD  
/2  
Audio  
Input  
C
S
R
I
IN –  
IN+  
4
3
V
+
O
–
+
C
I
2
BYPASS  
C
B
700 mW  
–
+
V
–
8
7
O
GND  
SHUTDOWN  
1
Bias  
Control  
From System Control  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD and MicroStar Junior are trademarks of Texas Instruments.  
Copyright 2002, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...23

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