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TPA741DGNG4 PDF预览

TPA741DGNG4

更新时间: 2024-11-24 03:58:47
品牌 Logo 应用领域
德州仪器 - TI 放大器功率放大器低压音频输入元件
页数 文件大小 规格书
24页 696K
描述
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER WITH DIFFERENTIAL INPUTS

TPA741DGNG4 数据手册

 浏览型号TPA741DGNG4的Datasheet PDF文件第2页浏览型号TPA741DGNG4的Datasheet PDF文件第3页浏览型号TPA741DGNG4的Datasheet PDF文件第4页浏览型号TPA741DGNG4的Datasheet PDF文件第5页浏览型号TPA741DGNG4的Datasheet PDF文件第6页浏览型号TPA741DGNG4的Datasheet PDF文件第7页 
TPA741  
www.ti.com  
SLOS316CJUNE 2000REVISED JUNE 2004  
700-mW MONO LOW-VOLTAGE AUDIO POWER  
AMPLIFIER WITH DIFFERENTIAL INPUTS  
FEATURES  
DESCRIPTION  
Fully Specified for 3.3-V and 5-V Operation  
Wide Power Supply Compatibility 2.5 V - 5.5 V  
Output Power for RL = 8  
– 700 mW at VDD = 5 V  
The TPA741 is a bridge-tied load (BTL) audio power  
amplifier developed especially for low-voltage appli-  
cations where internal speakers are required.  
Operating with a 3.3-V supply, the TPA741 can  
deliver 250-mW of continuous power into a BTL 8-Ω  
load at less than 0.6% THD+N throughout voice band  
frequencies. Although this device is characterized out  
to 20 kHz, its operation is optimized for narrower  
band applications such as wireless communications.  
The BTL configuration eliminates the need for exter-  
nal coupling capacitors on the output in most appli-  
cations, which is particularly important for small  
battery-powered equipment. This device features a  
shutdown mode for power-sensitive applications with  
a supply current of 7 µA during shutdown. The  
TPA741 is available in an 8-pin SOIC surface-mount  
package and the surface-mount PowerPAD™ MSOP,  
which reduces board space by 50% and height by  
40%.  
– 250 mW at VDD = 3.3 V  
Integrated Depop Circuitry  
Thermal and Short-Circuit Protection  
Surface-Mount Packaging  
– SOIC  
– PowerPAD™ MSOP  
D OR DGN PACKAGE  
(TOP VIEW)  
SHUTDOWN  
BYPASS  
IN+  
V –  
1
2
3
4
8
7
6
5
O
GND  
V
DD  
IN–  
V +  
O
V
6
5
DD  
V
DD  
R
F
V /2  
DD  
Audio  
Input  
C
S
R
I
IN–  
IN+  
4
V +  
O
+
C
I
3
2
BYPASS  
C
B
+
700 mW  
V –  
O
8
7
GND  
SHUTDOWN  
1
Bias  
Control  
From System Control  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2000–2004, Texas Instruments Incorporated  

TPA741DGNG4 替代型号

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TPA741DGNRG4 TI

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