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TPA4860Y

更新时间： 2024-11-20 13:02:11
品牌 Logo 应用领域
德州仪器 - TI 放大器功率放大器
页数 文件大小 规格书
24页 443K
描述
1.1W, 1 CHANNEL, AUDIO AMPLIFIER, UUC16

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TPA4860Y 技术参数

生命周期：Obsolete包装说明：DIE,
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8542.33.00.01风险等级：5.68
商用集成电路类型：AUDIO AMPLIFIER谐波失真：2%
JESD-30 代码：X-XUUC-N16信道数量：1
端子数量：16最高工作温度：85 °C
最低工作温度：-20 °C标称输出功率：1.1 W
封装主体材料：UNSPECIFIED封装代码：DIE
封装形状：UNSPECIFIED封装形式：UNCASED CHIP
认证状态：Not Qualified最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：2.7 V表面贴装：YES
温度等级：OTHER端子形式：NO LEAD
端子位置：UPPERBase Number Matches：1

TPA4860Y 数据手册

 浏览型号TPA4860Y的Datasheet PDF文件第2页浏览型号TPA4860Y的Datasheet PDF文件第3页浏览型号TPA4860Y的Datasheet PDF文件第4页浏览型号TPA4860Y的Datasheet PDF文件第5页浏览型号TPA4860Y的Datasheet PDF文件第6页浏览型号TPA4860Y的Datasheet PDF文件第7页 
TPA4860  
www.ti.com  
SLOS164B–SEPTEMBER 1996–REVISED JUNE 2004  
1-W MONO AUDIO POWER AMPLIFIER  
FEATURES  
D PACKAGE  
(TOP VIEW)  
•
•
•
•
•
•
•
•
•
•
1-W BTL Output (5 V, 0.2 % THD+N)  
3.3-V and 5-V Operation  
GND  
SHUTDOWN  
HP-SENSE  
GND  
GND  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
No Output Coupling Capacitors Required  
Shutdown Control (IDD = 0.6 µA)  
Headphone Interface Logic  
V 2  
O
IN+  
IN–  
Uncompensated Gains of 2 to 20 (BTL Mode)  
Surface-Mount Packaging  
BYPASS  
HP-IN1  
V
DD  
GAIN  
HP-IN2  
GND  
V 1  
Thermal and Short-Circuit Protection  
High Power Supply Rejection(56-dB at 1 kHz)  
LM4860 Drop-In Compatible  
O
GND  
DESCRIPTION  
The TPA4860 is a bridge-tied load (BTL) audio power amplifier capable of delivering 1 W of continuous average  
power into an 8-Ω load at 0.4 % THD+N from a 5-V power supply in voiceband frequencies (f < 5 kHz). A BTL  
configuration eliminates the need for external coupling capacitors on the output in most applications. Gain is  
externally configured by means of two resistors and does not require compensation for settings of 2 to 20.  
Features of this amplifier are a shutdown function for power-sensitive applications as well as headphone  
interface logic that mutes the output when the speaker drive is not required. Internal thermal and short-circuit  
protection increases device reliability. It also includes headphone interface logic circuitry to facilitate headphone  
applications. The amplifier is available in a 16-pin SOIC surface-mount package that reduces board space and  
facilitates automated assembly.  
TYPICAL APPLICATION CIRCUIT  
V
12  
10  
DD  
V
DD  
V /2  
DD  
C
S
R
F
Audio  
Input  
11 GAIN  
IN–  
R
I
13  
V 1  
O
C
I
14 IN+  
1 W  
C
B
V 2  
O
15  
V
DD  
BYPASS  
5
R
PU  
NC  
HP-IN1  
6
7
3
2
1, 4, 8, 9, 16  
HP-IN2  
Bias  
Control  
HP-SENSE  
SHUTDOWN  
Headphone  
Plug  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1996–2004, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...24

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