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TMS320C6670ACYPA2 PDF预览

TMS320C6670ACYPA2

更新时间: 2024-10-28 12:05:19
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
226页 2120K
描述
Multicore Fixed and Floating-Point System-on-Chip

TMS320C6670ACYPA2 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:FBGA, BGA841,29X29,32针数:841
Reach Compliance Code:compliantECCN代码:3A991.A.2
HTS代码:8542.31.00.01Factory Lead Time:12 weeks
风险等级:1.37桶式移位器:NO
位大小:32边界扫描:YES
格式:FLOATING POINT集成缓存:YES
内部总线架构:SINGLEJESD-30 代码:S-PBGA-B841
JESD-609代码:e1长度:24 mm
低功率模式:YES湿度敏感等级:4
DMA 通道数量:80端子数量:841
计时器数量:16最高工作温度:100 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA841,29X29,32
封装形状:SQUARE封装形式:GRID ARRAY, FINE PITCH
峰值回流温度(摄氏度):245电源:1,1.5,1.8 V
认证状态:Not QualifiedRAM(字数):32768
座面最大高度:3.39 mm子类别:Digital Signal Processors
最大供电电压:1.05 V最小供电电压:0.95 V
标称供电电压:1 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:24 mm
uPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, MIXEDBase Number Matches:1

TMS320C6670ACYPA2 数据手册

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TMS320C6670  
Multicore Fixed and Floating-Point System-on-Chip  
Data Manual  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Literature Number: SPRS689D  
March 2012  

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