Datasheet > 存储 > DRAM> TM497FBK32S-80

TM497FBK32S-80

更新时间： 2024-02-19 13:51:10

品牌	Logo	应用领域
德州仪器 - TI		存储内存集成电路动态存储器
页数	文件大小	规格书
12页	172K
描述
EXTENDED DATA OUT DYNAMIC RAM MODULES

阅读下载

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

TM497FBK32S-80 技术参数

生命周期：	Obsolete	零件包装代码：	SIMM
包装说明：	SIMM,	针数：	72
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8542.32.00.02	风险等级：	5.84
访问模式：	FAST PAGE WITH EDO	最长访问时间：	80 ns
其他特性：	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	JESD-30 代码：	R-XSMA-N72
内存密度：	134217728 bit	内存集成电路类型：	EDO DRAM MODULE
内存宽度：	32	功能数量：	1
端口数量：	1	端子数量：	72
字数：	4194304 words	字数代码：	4000000
工作模式：	ASYNCHRONOUS	最高工作温度：	70 °C
最低工作温度：		组织：	4MX32
输出特性：	3-STATE	封装主体材料：	UNSPECIFIED
封装代码：	SIMM	封装形状：	RECTANGULAR
封装形式：	MICROELECTRONIC ASSEMBLY	认证状态：	Not Qualified
刷新周期：	2048	最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	4.5 V	标称供电电压 (Vsup)：	5 V
表面贴装：	NO	技术：	MOS
温度等级：	COMMERCIAL	端子形式：	NO LEAD
端子位置：	SINGLE	Base Number Matches：	1

TM497FBK32S-80 数据手册

IMPORTANT NOTICE

Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue

any product or service without notice, and advise customers to obtain the latest version of relevant information

to verify, before placing orders, that information being relied on is current and complete. All products are sold

subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those

pertaining to warranty, patent infringement, and limitation of liability.

TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent

TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily

performed, except those mandated by government requirements.

CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF

DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL

APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR

WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER

CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO

BE FULLY AT THE CUSTOMER’S RISK.

In order to minimize risks associated with the customer’s applications, adequate design and operating

safeguards must be provided by the customer to minimize inherent or procedural hazards.

TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent

that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other

intellectual property right of TI covering or relating to any combination, machine, or process in which such

semiconductor products or services might be or are used. TI’s publication of information regarding any third

party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.

1...9 10 1112

下载PDF

与TM497FBK32S-80相关器件

型号	品牌	描述	获取价格	数据表
TM497GAD8A-10	TI	IC 4M X 8 FAST PAGE DRAM MODULE, 100 ns, SMA30, SIMM-30, Dynamic RAM	获取价格
TM497GAD8A-60	TI	4MX8 FAST PAGE DRAM MODULE, 60ns, SMA30, SIMM-30	获取价格
TM497GAD8A-70	TI	4MX8 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30	获取价格
TM497GAD8A-80	TI	4MX8 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30	获取价格
TM497GU8	TI	4194304-WORD BY 8-BIT DYNAMIC RAM MODULE	获取价格
TM497GU8-60	TI	4MX8 FAST PAGE DRAM MODULE, 60ns, SMA30, SIMM-30	获取价格

与TM497FBK32S-80相关文章

深入解析CS8416引脚说明、参数、技术特点
2024-06-03

1
TPA3116D2功放芯片参数详解、引脚说明
2024-06-03

1
移位寄存器74HC165引脚说明、驱动程序示例解读
2024-06-03

2
深入解析AD9833：DDS频率合成器的卓越性能与广泛应用
2024-06-03

2

产品中心

服务支持

精选活动

关于我们

帮助中心

TM497FBK32S-80

TM497FBK32S-80 技术参数

TM497FBK32S-80 数据手册

与TM497FBK32S-80相关器件

与TM497FBK32S-80相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

TM497FBK32S-80

TM497FBK32S-80 技术参数

TM497FBK32S-80 数据手册

与TM497FBK32S-80相关器件

与TM497FBK32S-80相关文章

您还可以找

您在本页遇到什么问题？