TLYE50CF

更新时间： 2024-11-09 03:12:11

品牌	Logo	应用领域
东芝 - TOSHIBA		/
页数	文件大小	规格书
3页	282K
描述
Panel Circuit Indicator

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中文翻译

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数据手册

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TLYE50CF 数据手册

TLYE50C(F)

TOSHIBA InGaAℓP LED

TLYE50C(F)

Unit: mm

○Panel Circuit Indicator

•

Lead(Pb)-free products (lead: Sn-Ag-Cu)

3mm package wide viewing angle

InGaAℓP

Emitted color: Yellow

Colored, Transparent lens

Applications: Various types of information panels, indicators for

amusement equipment and panel backlighting

illumination sources.

Absolute Maximum Ratings (Ta = 25°C)

CHARACTERISTICS

SYMBOL

RATING

UNIT

FORWARD CURRENT

REVERSE VOLTAGE

POWER DISSIPATION

120

°C

OPERATING TEMPERATURE

STORAGE TEMPERATURE

−40~100

−40~120

JEDEC

EIAJ

opr

stg

°C

Note: Using continuously under heavy loads (e.g. the application of high

temperature/current/voltage and the significant change in

temperature, etc.) may cause this product to decrease in the

reliability significantly even if the operating conditions (i.e.

TOSHIBA

4−3E1A

Weight: 0.14 g(Typ.)

operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

ELECTRICAL AND OPTICAL CHARACTERISTICS

(Ta = 25°C)

CHARACTERISTICS

SYMBOL

TEST CONDITION

MIN

TYP MAX UNIT

I =20mA

⎯

2.0

⎯

2.4

⎯

FORWARD VOLTAGE

V =4V

μA

REVERSE CURRENT

I =20mA(Note)

1530

⎯

3500

(590)

mcd

LUMINOUS INTENSITY

PEAK WAVELENGTH

I =20mA

Δ λ

I =20mA

⎯

SPECTRAL LINE HALF WIDTH

DOMINANT WAVELENGTH

I =20mA

⎯

587

(Note): Lamps are classified into the following ranks according to their luminous intensity. Each packing box includes

single Luminous Intensity class.

T:1530-4140mcd, U:2720-7360mcd, V:4760mcd -

Precautions

Please be careful of the following:

• Soldering temperature: 260°C max, soldering time: 3 s max

(soldering portion of lead: up to 1.6 mm from the body of the device)

• If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming

stress to the resin. Soldering should be performed after lead forming.

• This visible LED lamp also emits some IR light.

If a photo detector is located near the LED lamp, please ensure that it will not be affected by this IR light.

2007-10-01

12 3

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