Datasheet > TLV9002QDGKRQ1

TLV9002QDGKRQ1

更新时间： 2024-11-09 02:49:27

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
44页	2702K
描述
TLV900x-Q1 Low-Power RRIO 1-MHz Automotive Operational Amplifier

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

TLV9002QDGKRQ1 数据手册

TLV9001-Q1, TLV9002-Q1, TLV9004-Q1

SBOS980C – MAY 2019 – REVISED OCTOBER 2021

TLV900x-Q1 Low-Power RRIO 1-MHz Automotive Operational Amplifier

1 Features

3 Description

•

AEC-Q100 qualified for automotive applications

– Temperature grade 1: –40°C to +125°C, T_A

– Device HBM ESD classification level 2

– Device CDM ESD classification level C6

Scalable CMOS amplifier for low-cost applications

Rail-to-rail input and output

Low input offset voltage: ±0.4 mV

Unity-gain bandwidth: 1 MHz

Low broadband noise: 27 nV/√ Hz

Low input bias current: 5 pA

Low quiescent current: 60 µA\/Ch

Unity-gain stable

Internal RFI and EMI filter

Operational at supply voltages as low as 1.8 V

Easier to stabilize with higher capacitive load due

to resistive open-loop output impedance

Functional Safety-Capable

– Documentation avialable to aid functional safety

system design

The TLV900x-Q1 family includes single (TLV9001-

Q1), dual (TLV9002-Q1), and quad-channel

(TLV9004-Q1) low-voltage (1.8 V to 5.5 V) operational

amplifiers (op amps) with rail-to-rail input and output

swing capabilities. These op amps provide a cost-

effective solution for space-constrained automotive

applications such as infotainment and lighting where

low-voltage operation and high capacitive-load drive

are required. The capacitive-load drive of the

TLV900x-Q1 family is 500 pF, and the resistive open-

loop output impedance makes stabilization easier with

much higher capacitive loads. These op amps are

designed specifically for low-voltage operation (1.8 V

to 5.5 V) with performance specifications similar to the

TLV600x-Q1 devices.

•

The robust design of the TLV900x-Q1 family simplifies

circuit design. The op amps feature unity-gain

stability, an integrated RFI and EMI rejection filter, and

no-phase reversal in overdrive conditions.

•

2 Applications

Device Information

PACKAGE

SOT-23 (5)⁽²⁾

PART NUMBER ⁽¹⁾

BODY SIZE (NOM)

1.60 mm × 2.90 mm

1.25 mm × 2.00 mm

3.91 mm × 4.90 mm

3.00 mm × 4.40 mm

3.00 mm × 3.00 mm

4.20 mm × 1.90 mm

8.65 mm × 3.91 mm

4.40 mm × 5.00 mm

•

Optimized for AEC-Q100 grade 1 applications

Infotainment & Cluster

Passive safety

Body electronics and lighting

HEV/EV inverter and motor control

On-board (OBC) & wireless charger

Powertrain current sensor

Advanced driver assistance systems (ADAS)

Single-supply, low-side, unidirectional current-

sensing circuit

TLV9001-Q1

SC70 (5)⁽²⁾

SOIC (8)

TLV9002-Q1

TLV9004-Q1

TSSOP (8)⁽²⁾

VSSOP (8)

SOT-23 (14)

SOIC (14)

TSSOP (14)

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

(2) Package is for preview only.

Single-Pole, Low-Pass Filter

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

12 3 4 5 6 7...44

中文翻译

下载PDF

与TLV9002QDGKRQ1相关器件

型号	品牌	获取价格	描述	数据表
TLV9002QDRQ1	TI	获取价格	TLV900x-Q1 Low-Power RRIO 1-MHz Automotive Operational Amplifier
TLV9002SIDGSR	TI	获取价格	适用于成本优化型应用的双路、5.5V、1MHz、RRIO 运算放大器 \| DGS \| 10
TLV9002SIRUGR	TI	获取价格	适用于成本优化型应用的双路、5.5V、1MHz、RRIO 运算放大器 \| RUG \| 10
TLV9002SIYCKR	TI	获取价格	TLV900x Low-Power, RRIO, 1-MHz Operational Amplifier for Cost-Sensitive Systems
TLV9004	TI	获取价格	适用于成本优化型应用的四路、5.5V、1MHz、RRIO 运算放大器
TLV9004IDR	TI	获取价格	适用于成本优化型应用的四路、5.5V、1MHz、RRIO 运算放大器 \| D \| 14 \|
TLV9004IDYYR	TI	获取价格	TLV900x Low-Power, RRIO, 1-MHz Operational Amplifier for Cost-Sensitive Systems
TLV9004IPWR	TI	获取价格	适用于成本优化型应用的四路、5.5V、1MHz、RRIO 运算放大器 \| PW \| 14
TLV9004IRTER	TI	获取价格	适用于成本优化型应用的四路、5.5V、1MHz、RRIO 运算放大器 \| RTE \| 16
TLV9004IRUCR	TI	获取价格	适用于成本优化型应用的四路、5.5V、1MHz、RRIO 运算放大器 \| RUC \| 14

与TLV9002QDGKRQ1相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

21
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

19
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

44
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

38

产品中心

服务支持

精选活动

关于我们

帮助中心

TLV9002QDGKRQ1

TLV9002QDGKRQ1 数据手册

与TLV9002QDGKRQ1相关器件

与TLV9002QDGKRQ1相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

TLV9002QDGKRQ1

TLV9002QDGKRQ1 数据手册

与TLV9002QDGKRQ1相关器件

与TLV9002QDGKRQ1相关文章

您还可以找

您在本页遇到什么问题？