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TLV2362IPS PDF预览

TLV2362IPS

更新时间: 2024-11-01 13:01:23
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德州仪器 - TI 运算放大器
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TLV2362IPS 数据手册

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ꢀ ꢁꢂꢃ ꢄ ꢅ ꢆ ꢇ ꢀꢁꢂ ꢃꢄ ꢅꢃ  
ꢈꢉ ꢊ ꢈꢋꢌ ꢍꢎ ꢏꢐ ꢎꢑ ꢒꢓꢔꢍ ꢁ ꢐꢕꢋꢂꢐ ꢁꢀꢒꢊ ꢍ ꢐ ꢌꢍꢎ ꢒꢀ ꢉꢐ ꢓꢒꢁ ꢒꢑ ꢌ ꢁꢉ ꢏꢉ ꢍꢎ ꢖ  
SLOS195G − FEBRUARY 1997 − REVISED NOVEMBER 2003  
TLV2361 . . . DBV PACKAGE  
(TOP VIEW)  
D
Low Supply-Voltage  
Operation . . . V = 1 V Min  
CC  
D
D
D
D
Wide Bandwidth . . . 7 MHz Typ at  
= 2.5 V  
1
2
3
5
4
IN+  
V
CC+  
V
CC  
V
CC−  
IN−  
High Slew Rate . . . 3 V/µs Typ at  
= 2.5 V  
OUT  
V
CC  
Wide Output Voltage Swing . . . 2.4 V Typ  
at V = 2.5 V, R = 10 kΩ  
TLV2362 . . . D, DGK, P, PS, OR PW PACKAGE  
(TOP VIEW)  
CC  
L
Low Noise . . . 8 nV/Hz Typ at f = 1 kHz  
1OUT  
1IN−  
1IN+  
V
CC+  
1
2
3
4
8
7
6
5
2OUT  
2IN−  
2IN+  
description/ordering information  
The TLV236x devices are high-performance dual  
operational amplifiers built using an original  
Texas Instruments bipolar process. These  
devices can be operated at a very low supply  
V
CC−  
voltage ( 1 V), while maintaining a wide output swing. The TLV236x devices offer a dramatically improved  
dynamic range of signal conditioning in low-voltage systems. The TLV236x devices also provide higher  
performance than other general-purpose operational amplifiers by combining higher unity-gain bandwidth and  
faster slew rate. With their low distortion and low-noise performance, these devices are well suited for audio  
applications.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
Reel of 2500  
Tube of 50  
TLV2361CDBVR  
TLV2361CDBVT  
TLV2361IDBVR  
TLV2361IDBVT  
TLV2362IDGKR  
TLV2362IP  
−0°C to 70°C  
SOT-23-5 (DBV)  
VAAC  
SOT-23-5 (DBV)  
VAAI  
MSOP/VSSOP (DGK)  
PDIP (P)  
YBS  
TLV2362IP  
Tube of 75  
TLV2362ID  
−40°C to 85°C  
SOIC (D)  
SOP (PS)  
2362I  
Reel of 2500  
Reel of 2000  
Tube of 150  
Reel of 2000  
TLV2362IDR  
TLV2362IPSR  
TLV2362IPW  
TLV2362IPWR  
TY2362  
TSSOP (PW)  
TY2362  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢀꢥ  
Copyright 2003, Texas Instruments Incorporated  
ꢡ ꢥ ꢢ ꢡꢚ ꢛꢯ ꢝꢜ ꢠ ꢨꢨ ꢦꢠ ꢞ ꢠ ꢟ ꢥ ꢡ ꢥ ꢞ ꢢ ꢪ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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