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TLV2362Y

更新时间： 2024-11-05 22:37:11
品牌 Logo 应用领域
德州仪器 - TI 运算放大器
页数 文件大小 规格书
17页 276K
描述
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS

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TLV2362Y 技术参数

生命周期：Obsolete零件包装代码：DIE
包装说明：DIE针数：8
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8542.33.00.01风险等级：5.73
放大器类型：OPERATIONAL AMPLIFIER最大平均偏置电流 (IIB)：0.25 µA
标称共模抑制比：75 dB最大输入失调电压：7500 µV
JESD-30 代码：S-XUUC-N8负供电电压上限：-3.5 V
标称负供电电压 (Vsup)：-1.5 V功能数量：2
端子数量：8最高工作温度：85 °C
最低工作温度：-20 °C封装主体材料：UNSPECIFIED
封装代码：DIE封装形状：SQUARE
封装形式：UNCASED CHIP认证状态：Not Qualified
标称压摆率：2.5 V/us供电电压上限：3.5 V
标称供电电压 (Vsup)：1.5 V表面贴装：YES
技术：BIPOLAR温度等级：OTHER
端子形式：NO LEAD端子位置：UPPER
标称均一增益带宽：6000 kHzBase Number Matches：1

TLV2362Y 数据手册

 浏览型号TLV2362Y的Datasheet PDF文件第2页浏览型号TLV2362Y的Datasheet PDF文件第3页浏览型号TLV2362Y的Datasheet PDF文件第4页浏览型号TLV2362Y的Datasheet PDF文件第5页浏览型号TLV2362Y的Datasheet PDF文件第6页浏览型号TLV2362Y的Datasheet PDF文件第7页 
TLV2361, TLV2361Y, TLV2362, TLV2362Y  
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS  
SLOS195B – FEBRUARY 1997 – REVISED OCTOBER 1998  
TLV2361 . . . DBV PACKAGE  
(TOP VIEW)  
Low Supply-Voltage  
Operation . . . V = ±1 V Min  
CC  
Wide Bandwidth . . . 7 MHz Typ at  
± = ±2.5 V  
5
1
2
3
IN+  
V
+
CC  
V
CC  
High Slew Rate . . . 3 V/µs Typ at  
± = ±2.5 V  
V
–
CC  
V
CC  
IN–  
Wide Output Voltage Swing . . . ±2.4 V Typ  
at V ± = ±2.5 V, R = 10 kΩ  
OUT  
4
CC  
L
Low Noise . . . 8 nV/√Hz Typ at f = 1 kHz  
TLV2362 . . . D, P, OR PW PACKAGE  
(TOP VIEW)  
Package Options Include SOT-23 (DBV)  
Package for the TLV2361 and Plastic  
Small-Outline (D), Thin Shrink  
Small-Outline (PW), and Dual-In-Line (P)  
Packages for the TLV2362  
1OUT  
1IN–  
1IN+  
V
+
CC  
1
2
3
4
8
7
6
5
2OUT  
2IN–  
2IN+  
V
–
CC  
description  
The TLV236x devices are high-performance dual operational amplifiers built using an original Texas  
Instruments bipolar process. These devices can be operated at a very low supply voltage (±1 V), while  
maintaining a wide output swing. The TLV236x devices offer a dramatically improved dynamic range of signal  
conditioning in low-voltage systems. The TLV236x devices also provide higher performance than other  
general-purpose operational amplifiers by combining higher unity-gain bandwidth and faster slew rate. With  
their low distortion and low-noise performance, these devices are well suited for audio applications.  
The C-suffix devices are characterized for operation from 0°C to 70°C and the I-suffix devices are characterized  
for operation from –40°C to 85°C.  
TLV2361 AVAILABLE OPTIONS  
PACKAGED DEVICES  
CHIP  
‡
T
A
SYMBOL  
FORM  
(Y)  
SOT-23  
†
(DBV)  
0°C to 70°C  
TLV2361CDBV  
TLV2361IDBV  
VAAC  
VAAI  
TLV2361Y  
–40°C to 85°C  
†
‡
The DBV packages are only available taped and reeled.  
Chip forms are specified for operation at 25°C only.  
TLV2362 AVAILABLE OPTIONS  
PACKAGED DEVICES  
§
CHIP  
FORM  
(Y)  
‡
TSSOP  
(PW)  
T
A
SMALL OUTLINE  
(D)  
PLASTIC DIP  
(P)  
–20°C to 85°C  
TLV2362ID  
TLV2362IP  
TLV2362IPWR  
TLV2362Y  
‡
§
Chip forms are specified for operation at 25°C only.  
The D packages are available taped and reeled. Add an R to the package suffix (e.g., TLV2362IDR).  
The PW packages are available left-ended taped and reeled only, (e.g., TLV2362IPWR).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1998, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...17

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