TLV2322, TLV2322Y, TLV2324, TLV2324Y
LinCMOS LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
SLOS187 – FEBRUARY 1997
TLV2322
D OR P PACKAGE
(TOP VIEW)
Wide Range of Supply Voltages Over
Specified Temperature Range:
T = –40°C to 85°C . . . 2 V to 8 V
A
Fully Characterized at 3 V and 5 V
Single-Supply Operation
1OUT
1IN–
1IN+
/GND
V
DD
1
2
3
4
8
7
6
5
2OUT
2IN–
2IN+
Common-Mode Input Voltage Range
Extends Below the Negative Rail and up to
V
DD–
V
–1 V at T = 25°C
DD
A
TLV2322
PW PACKAGE
(TOP VIEW)
Output Voltage Range Includes Negative
Rail
12
High Input Impedance . . . 10 Ω Typical
1
2
3
8
7
6
5
1OUT
1IN–
1IN+
/GND
V
DD+
ESD-Protection Circuitry
2OUT
2IN–
2IN+
Designed-In Latch-Up Immunity
4
V
DD –
description
TLV2324
The TLV232x operational amplifiers are in a family
of devices that has been specifically designed for
use in low-voltage single-supply applications.
This amplifier is especially well suited to
ultra-low-power systems that require devices to
consume the absolute minimum of supply
currents. Each amplifier is fully functional down to
a minimum supply voltage of 2 V, is fully
characterized, tested, and specified at both 3-V
and5-Vpowersupplies. Thecommon-modeinput
voltage range includes the negative rail and
extends to within 1 V of the positive rail.
D OR N PACKAGE
(TOP VIEW)
4OUT
1OUT
1
2
3
4
5
6
7
14
13
12
11
10
9
4IN –
4IN +
1IN –
1IN +
V
/GND
V
DD –
DD+
3IN +
3IN –
3OUT
2IN +
2IN –
2OUT
8
TLV2324
PW PACKAGE
(TOP VIEW)
These amplifiers are specifically targeted for use
in very low-power, portable, battery-driven
applications with the maximum supply current per
operational amplifier specified at only 27 µA over
its full temperature range of –40°C to 85°C.
1
1OUT
1IN –
1IN +
4OUT
4IN –
4IN +
14
V
V
/GND
DD+
DD –
2IN +
2IN –
2OUT
3IN +
3IN –
3OUT
7
8
‡
AVAILABLE OPTIONS
PACKAGED DEVICES
§
V
IO
max AT
25°C
CHIP FORM
(Y)
T
A
†
PLASTIC DIP PLASTIC DIP
SMALL OUTLINE
(D)
TSSOP
(PW)
(N)
(P)
TLV2322IP
—
9 mV
TLV2322ID
TLV2324ID
—
TLV2322IPWLE
TLV2324IPWLE
TLV2322Y
TLV2324Y
–40°C to 85°C
10 mV
TLV2324IN
†
‡
§
The D package is available taped and reeled. Add R suffix to the device type (e.g., TLV2322IDR).
The PW package is only available left-end taped and reeled (e.g., TLV2322IPWLE).
Chip forms are tested at 25°C only.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LinCMOS is a trademark of Texas Instruments Incorporated.
Copyright 1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265