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TLP838

更新时间: 2024-11-01 19:55:03
品牌 Logo 应用领域
东芝 - TOSHIBA 输出元件光电
页数 文件大小 规格书
9页 269K
描述
Slotted Switch - Transistor Output, 5 mm SLOT WIDTH, 1 CHANNEL SLOTTED OPTICAL SWITCH TRANSISTOR OUTPUT

TLP838 技术参数

生命周期:ObsoleteReach Compliance Code:unknown
风险等级:5.82Coll-Emtr Bkdn Voltage-Min:35 V
配置:SINGLE最大暗电源:100 nA
最大正向电流:0.025 A功能数量:1
标称通态集电极电流:50 mA最高工作温度:75 °C
最低工作温度:-10 °C光电设备类型:TRANSISTOR OUTPUT SLOTTED SWITCH
标称槽宽:5 mmBase Number Matches:1

TLP838 数据手册

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TLP838  
TOSHIBA Photo Interrupter Infrared LED + Photo Transistor  
TLP838  
Home electronics equipment such as VTRs and  
Unit: mm  
CD players  
Office equipment such as photocopiers, printers  
and fax machines  
Automatic service equipment such as commodity  
and ticket vending machines  
Various position-detection sensors  
The TLP838 photo-interrupter consists of a GaAs infrared  
LED and an Si phototransistor.  
Housed in a short lead package, this device is ideal for  
automatic mounting.  
Low-back packeage: Packeage heignt 7.4 mm  
Desined for direct mounting on printed circuit boards direct  
mounting type (positioning pins included)  
Short leads enabling automatic mounting:  
Lead length 3.1 ± 0.3 mm  
TOSHIBA  
Board thickness: 1.6 mm or less  
Gap: 5 mm  
Weight: 0.50 g (typ.)  
Resolution: Slit width of 0.5 mm  
High current transfer ratio: I /I = 5% (min)  
C
F
High temperature operation: T  
= 95°C (max)  
opr  
High response speed: t , t = 15 µs (typ.)  
r
f
Detector is impermeable to visible light.  
Package material: Polybutylene-terephthalate (UL94V-0, black)  
Maximum Ratings (Ta = 25°C)  
Characteristics  
Forward current  
Symbol  
Rating  
Unit  
mA  
I
50  
0.33  
2  
F
(Ta > 25°C)  
Forward current  
I /°C  
F
mA/°C  
derating  
(Ta > 85°C)  
Reverse voltage  
V
5
V
V
R
Collector-emitter voltage  
Emitter-collector voltage  
Collector power dissipation  
V
35  
CEO  
ECO  
V
5
V
P
75  
mW  
C
Collector power dissipation  
P /°C  
1  
mW/°C  
C
derating (Ta > 25°C)  
Collector current  
I
50  
mA  
°C  
°C  
°C  
C
Operating temperature  
T
30 95  
40 100  
260  
opr  
Storage temperature  
T
stg  
sol  
Soldering temperature (5 s) (Note 1)  
T
Note 1: Soldering is performed 1.5 mm from the bottom of resin package.  
1
2002-03-19  

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