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TLP848

更新时间： 2024-11-01 03:59:23
品牌 Logo 应用领域
东芝 - TOSHIBA 光电开关插槽式开关输出元件
页数 文件大小 规格书
12页 238K
描述
Personal Equipment and Small-sized OA Equipment

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中文翻译

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TLP848 技术参数

是否Rohs认证： 符合生命周期：Obsolete
包装说明：LEAD FREE, SURFACE MOUNT PACKAGE-4Reach Compliance Code：unknown
风险等级：5.81Coll-Emtr Bkdn Voltage-Min：15 V
配置：SINGLE最大暗电源：50 nA
最大正向电流：0.03 A间隙大小：1.2 mm
安装特点：SURFACE MOUNT功能数量：1
最大通态电流：0.05 A最大通态电压：15 V
标称通态集电极电流：50 mA最高工作温度：85 °C
最低工作温度：-30 °C光电设备类型：TRANSISTOR OUTPUT SLOTTED SWITCH
输出电路类型：Transistor最长响应时间：0.00005 s
标称槽宽：1.2 mm表面贴装：YES
Base Number Matches：1

TLP848 数据手册

 浏览型号TLP848的Datasheet PDF文件第2页浏览型号TLP848的Datasheet PDF文件第3页浏览型号TLP848的Datasheet PDF文件第4页浏览型号TLP848的Datasheet PDF文件第5页浏览型号TLP848的Datasheet PDF文件第6页浏览型号TLP848的Datasheet PDF文件第7页 
TLP848  
TOSHIBA Photointerrupter Infrared LED + Phototransistor  
TLP848  
○Camera Module for Mobile Phone  
○Digital Still Camera and Video Camera  
○Personal Equipment and Small-sized OA Equipment  
The TLP848 is a surface-mount photointerrupter which is composed of a  
GaAs infrared LED and a Si phototransistor.  
It is an ultra compact package. Moreover it has a wider gap width than  
1mm gap width of industry-standard and has a high resolution.  
•
•
•
•
•
•
•
Ultra compact package : 2.8×1.9×2.5mm (typ.)  
Surface-mount type  
Lead(Pb)-Free  
Gap width : 1.2mm (typ.)  
High resolution : Slit width 0.3 mm (typ.)  
TOSHIBA  
11-3B1  
High current transfer ratio : I /I = 3% (min)  
C F  
Material of the package : PPS (Polyphenylene sulfide)  
(UL94V-0)  
Weight: 0.017 g (typ.)  
Absolute Maximum Ratings (Ta = 25°C)  
Marking (Note 2)  
Characteristics  
Forward current  
Symbol  
Rating  
Unit  
Weekly Code  
I
30  
−0.33  
5
mA  
mA/°C  
V
F
Forward current derating (Ta>25°C)  
Reverse voltage  
ΔI °C  
F/  
V
R
Collector-emitter voltage  
Emitter-collector voltage  
Collector power dissipation  
V
15  
V
CEO  
ECO  
V
5
V
P
75  
mW  
C
Collector power dissipation derating  
ΔP °C  
C/  
−1  
mW/°C  
(Ta>25℃)  
Collector current  
I
50  
mA  
°C  
°C  
°C  
C
Operating temperature range  
Storage temperature range  
T
opr  
−30 to 85  
−40 to 100  
250  
T
stg  
sol  
Soldering temperature  
(Note 1)  
T
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: The reflow time and the example of temperature profile are shown in the section entitled Mounting Method.  
Note 2: Weekly code: (Three digits)  
Week of manufacture  
(01 for first week of year, continues up to 52 or 53)  
Year of manufacture  
(One low-order digits of calendar year)  
1
2007-10-01  
1234567...12

中文翻译

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