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TLK1501AIRCPR

更新时间： 2024-11-09 13:14:47

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
26页	405K
描述
SPECIALTY TELECOM CIRCUIT, PQFP64, PLASTIC, VQFP-64

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TLK1501AIRCPR 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	QFP	包装说明：	HVFQFP,
针数：	64	Reach Compliance Code：	unknown
HTS代码：	8542.39.00.01	风险等级：	5.08
JESD-30 代码：	S-PQFP-G64	JESD-609代码：	e4
长度：	10 mm	湿度敏感等级：	3
功能数量：	1	端子数量：	64
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	HVFQFP
封装形状：	SQUARE	封装形式：	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：	260	认证状态：	Not Qualified
座面最大高度：	1 mm	标称供电电压：	2.5 V
表面贴装：	YES	电信集成电路类型：	TELECOM CIRCUIT
温度等级：	INDUSTRIAL	端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING	端子节距：	0.5 mm
端子位置：	QUAD	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	10 mm	Base Number Matches：	1

TLK1501AIRCPR 数据手册

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SLLS428F − JUNE 2000 − REVISED JANUARY 2004

Hot Plug Protection

On-Chip 8-Bit/10-Bit (8B/10B)

Encoding/Decoding, Comma Alignment,

and Link Synchronization

0.6 to 1.5 Gigabits Per Second (Gbps)

Serializer/Deserializer

On-Chip PLL Provides Clock Synthesis

From Low-Speed Reference

High-Performance 64-Pin VQFP Thermally

Enhanced Package (PowerPAD)

2.5 V Power Supply for Low Power

Operation

Receiver Differential Input Thresholds

200 mV Minimum

Typical Power: 250 mW

Programmable Voltage Output Swing on

Serial Output

Loss of Signal (LOS) Detection

Interfaces to Backplane, Copper Cables, or

Optical Converters

Ideal for High-Speed Backplane

Interconnect and Point-to-Point Data Link

Rated for Industrial Temperature Range

description

The TLK1501 is a member of the transceiver family of multigigabit transceivers used in ultrahigh-speed

bidirectional point-to-point data transmission systems. The TLK1501 supports an effective serial interface

speed of 0.6 Gbps to 1.5 Gbps, providing up to 1.2 Gbps of data bandwidth. The TLK1501 is pin-for-pin

compatible with the TLK2500. The TLK1501 is both pin-for-pin compatible with and functionally identical to the

TLK2501, a 1.6 to 2.5 Gbps transceiver, providing a wide range of performance solutions with no required board

layout changes.

The primary application of this chip is to provide very high-speed I/O data channels for point-to-point baseband

data transmission over controlled impedance media of approximately 50 Ω. The transmission media can be

printed-circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer is

dependent upon the attenuation characteristics of the media and the noise coupling to the environment.

This device can also be used to replace parallel data transmission architectures by providing a reduction in the

number of traces, connector terminals, and transmit/receive terminals. Parallel data loaded into the transmitter

is delivered to the receiver over a serial channel, which can be a coaxial copper cable, a controlled impedance

backplane, or an optical link. It is then reconstructed into its original parallel format. It offers significant power

and cost savings over current solutions, as well as scalability for higher data rate in the future.

The TLK1501 performs data conversion parallel-to-serial and serial-to-parallel. The clock extraction functions

as a physical layer interface device. The serial transceiver interface operates at a maximum speed of 1.5 Gbps.

The transmitter latches 16-bit parallel data at a rate based on the supplied reference clock (GTX_CLK). The

16-bit parallel data is internally encoded into 20 bits using an 8-bit/10-bit (8B/10B) encoding format. The

resulting 20-bit word is then transmitted differentially at 20 times the reference clock (GTX_CLK) rate. The

receiver section performs the serial-to-parallel conversion on the input data, synchronizing the resulting 20-bit

wide parallel data to the extracted reference clock (RX_CLK). It then decodes the 20 bit wide data using

8-bit/10-bit decoding format resulting in 16 bits of parallel data at the receive data terminals (RXD0-15). The

outcome is an effective data payload of 480 Mbps to 1.2 Gbps (16 bits data x the GTX_CLK frequency).

The TLK1501 is housed in a high performance, thermally enhanced, 64-pin VQFP PowerPAD package. Use

of the PowerPAD package does not require any special considerations except to note that the PowerPAD, which

is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. It is

recommended that the TLK1501 PowerPAD be soldered to the thermal land on the board. All ac performance

specifications in this data sheet are measured with the PowerPAD soldered to the test board.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PowerPAD is a trademark of Texas Instruments.

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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

12 3 4 5 6 7...26

中文翻译

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与TLK1501AIRCPR相关器件

型号	品牌	获取价格	描述	数据表
TLK1501IRCP	TI	获取价格	0.6 TO 1.5 GBPS TRANSCEIVER
TLK1501IRCPG4	TI	获取价格	0.6 TO 1.5 GBPS TRANSCEIVER
TLK1501IRCPR	TI	获取价格	0.6 TO 1.5 GBPS TRANSCEIVER
TLK1501IRCPRG4	TI	获取价格	0.6 TO 1.5 GBPS TRANSCEIVER
TLK1521	TI	获取价格	500 Mbps to 1.3 Gbps TRANSCEIVER
TLK1521IPAP	TI	获取价格	500 Mbps to 1.3 Gbps 18 bit Transceiver 64-HTQFP -40 to 85
TLK1521IPAPG4	TI	获取价格	500 Mbps to 1.3 Gbps TRANSCEIVER
TLK1521PAP	TI	获取价格	SPECIALTY TELECOM CIRCUIT, PQFP64, POWERPAD, PLASTIC, HTQFP-64
TLK2010B	SUMIDA	获取价格	RF Transformer, ROHS COMPLIANT
TLK2011B	SUMIDA	获取价格	RF Transformer, ROHS COMPLIANT

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