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TLGU23TP PDF预览

TLGU23TP

更新时间: 2024-11-14 03:27:27
品牌 Logo 应用领域
东芝 - TOSHIBA 可见光LED光电
页数 文件大小 规格书
5页 187K
描述
Panel Circuit Indicator

TLGU23TP 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Active包装说明:LEAD FREE PACKAGE-2
Reach Compliance Code:unknownHTS代码:8541.40.20.00
风险等级:5.21Is Samacsys:N
颜色:GREEN配置:SINGLE
最大正向电流:0.03 A透镜类型:TRANSPARENT
标称发光强度:4000.0 mcd安装特点:RADIAL MOUNT
功能数量:1端子数量:2
最高工作温度:100 °C最低工作温度:-40 °C
光电设备类型:SINGLE COLOR LED总高度:9.8 mm
包装方法:BULK峰值波长:574 nm
形状:ROUND尺寸:5 mm
表面贴装:NOT代码:T-1 3/4
端子节距:2.54 mmBase Number Matches:1

TLGU23TP 数据手册

 浏览型号TLGU23TP的Datasheet PDF文件第2页浏览型号TLGU23TP的Datasheet PDF文件第3页浏览型号TLGU23TP的Datasheet PDF文件第4页浏览型号TLGU23TP的Datasheet PDF文件第5页 
TLGU23TP(F),TLPGU23TP(F)  
TOSHIBA InGaAlP LED  
TLGU23TP(F),TLPGU23TP(F)  
Panel Circuit Indicator  
Unit: mm  
Lead(Pb)-free products (lead: Sn-Ag-Cu)  
5mm package  
InGaAP  
Transparent lens.  
Colors: Green, Pure green  
Applications: Various types of information panels, indicators for  
amusement equipment and panel backlighting  
illumination sources.  
Stopper lead type is also available.  
TLGU23T(F), TLPGU23T(F)  
Lineup  
Product Name  
Color  
Material  
JEDEC  
JEITA  
TLGU23TP(F)  
Green  
InGaAlP  
TLPGU23TP(F)  
Pure green  
TOSHIBA  
4-5AL2  
Weight: 0.31 g (Typ.)  
Absolute Maximum Ratings (Ta = 25°C)  
Operating  
Temperature  
Storage  
Temperature  
(°C)  
Forward Current  
Reverse Voltage  
(V)  
Power Dissipation  
Product Name  
I
(mA)  
V
P (mW)  
D
F
R
T
opr  
(°C)  
T
stg  
TLGU23TP(F)  
30  
30  
4
72  
72  
40~100  
40~120  
TLPGU23TP(F)  
4
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2007-10-01  

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