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TLGU50TF

更新时间： 2024-09-26 03:27:27
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
4页 230K
描述
Panel Circuit Indicators

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中文翻译

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TLGU50TF 数据手册

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TL(GU,PGU)50T(F)  
TOSHIBA InGaAℓP LED  
TLGU50T(F),TLPGU50T(F)  
Panel Circuit Indicators  
Unit: mm  
•
•
•
•
•
•
•
•
•
Lead(Pb)-free products (lead: Sn-Ag-Cu)  
3mm package  
InGaAℓP technology  
All plastic mold type  
Transparent lens  
Line-up: 2 colors (green and pure green)  
High intensity light emission  
Excellent low current light output  
Applications: message boards, security devices and dashboard  
displays  
Lineup  
Product Name  
Color  
Material  
TLGU50T(F)  
Green  
InGaAlP  
JEDEC  
JEITA  
―
―
TLPGU50T(F)  
Pure Green  
TOSHIBA  
4-3E1A  
Weight: 0.14 g(Typ.)  
Absolute Maximum Ratings (Ta = 25°C)  
Operating  
Storage  
Temperature  
(°C)  
Forward Current  
Reverse Voltage  
(V)  
Power Dissipation  
Temperature  
(°C)  
Product Name  
I
(mA)  
V
P (mW)  
D
F
R
T
opr  
T
stg  
TLFGU50T(F)  
TLPGU50T(F)  
30  
30  
4
72  
72  
−40~100  
−40~120  
4
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if  
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Electrical and Optical Characteristics (Ta = 25°C)  
Luminous Intensity  
Forward Voltage  
Reverse Current  
Typ. Emission Wavelength  
Product Name  
I
V
I
R
V
F
Min  
476  
Typ.  
I
Typ.  
2.1  
Max  
I
Max  
50  
V
R
λ
λ
Δλ  
I
F
F
F
d
P
TLGU50T(F)  
TLPGU50T(F)  
Unit  
571  
558  
(574)  
(562)  
nm  
17  
20  
20  
1200  
20  
20  
2.4  
20  
20  
4
14  
153  
450  
2.1  
2.4  
50  
4
mA  
mcd  
mA  
V
mA  
μA  
V
Precautions  
Please be careful of the following:  
Soldering temperature: 260°C max, soldering time: 3 s max  
(soldering portion of lead: up to 1.6 mm from the body of the device)  
If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress  
to the resin. Soldering should be performed after lead forming.  
•
•
•
This visible LED lamp also emits some IR light.  
If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.  
1
2007-10-01  
1234

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