是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | HLSSOP, | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 27 weeks |
风险等级: | 5.57 | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | R-PDSO-G24 | 长度: | 8.65 mm |
湿度敏感等级: | 3 | 功能数量: | 1 |
端子数量: | 24 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HLSSOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
座面最大高度: | 1.7 mm | 最大供电电压 (Vsup): | 18 V |
最小供电电压 (Vsup): | 6 V | 标称供电电压 (Vsup): | 13.5 V |
表面贴装: | YES | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 3.9 mm |
Base Number Matches: | 1 |
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