是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | SOIC |
包装说明: | PLASTIC, SOP-36 | 针数: | 36 |
Reach Compliance Code: | not_compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.8 | 商用集成电路类型: | CONSUMER CIRCUIT |
JESD-30 代码: | R-PDSO-G36 | JESD-609代码: | e3 |
长度: | 15.9 mm | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 36 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HSSOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 3.5 mm | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.75 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 11 mm |
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