是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFP |
包装说明: | LFQFP, | 针数: | 64 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.82 | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | S-PQFP-G64 | 长度: | 10 mm |
功能数量: | 1 | 端子数量: | 64 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LFQFP |
封装形状: | SQUARE | 封装形式: | FLATPACK, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 1.6 mm | 最大供电电压 (Vsup): | 5.25 V |
最小供电电压 (Vsup): | 4.75 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 10 mm |
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