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TK100L60W PDF预览

TK100L60W

更新时间: 2024-11-21 12:33:23
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
10页 251K
描述
MOSFETs Silicon N-Channel MOS (DTMOS)

TK100L60W 技术参数

生命周期:Active包装说明:FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code:unknown风险等级:5.69
雪崩能效等级(Eas):1582 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:600 V
最大漏极电流 (ID):100 A最大漏源导通电阻:0.018 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):400 A
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

TK100L60W 数据手册

 浏览型号TK100L60W的Datasheet PDF文件第2页浏览型号TK100L60W的Datasheet PDF文件第3页浏览型号TK100L60W的Datasheet PDF文件第4页浏览型号TK100L60W的Datasheet PDF文件第5页浏览型号TK100L60W的Datasheet PDF文件第6页浏览型号TK100L60W的Datasheet PDF文件第7页 
TK100L60W  
MOSFETs Silicon N-Channel MOS (DTMOS)  
TK100L60W  
1. Applications  
Switching Voltage Regulators  
2. Features  
(1) Low drain-source on-resistance: RDS(ON) = 0.015 (typ.)  
by used to Super Junction Structure : DTMOS  
(2) Easy to control Gate switching  
(3) Enhancement mode: Vth = 2.7 to 3.7 V (VDS = 10 V, ID = 5 mA)  
3. Packaging and Internal Circuit  
1: Gate  
2: Drain (Heatsink)  
3: Source  
TO-3P(L)  
4. Absolute Maximum Ratings (Note) (Ta = 25unless otherwise specified)  
Characteristics  
Symbol  
Rating  
Unit  
V
Drain-source voltage  
Gate-source voltage  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
VDSS  
VGSS  
ID  
600  
±30  
(Note 1)  
(Note 1)  
100  
A
IDP  
400  
(Tc = 25)  
PD  
797  
W
mJ  
A
Single-pulse avalanche energy  
Avalanche current  
(Note 2)  
EAS  
IAR  
1582  
25  
Reverse drain current (DC)  
Reverse drain current (pulsed)  
Channel temperature  
(Note 1)  
(Note 1)  
IDR  
100  
IDRP  
Tch  
400  
150  
Storage temperature  
Tstg  
TOR  
-55 to 150  
0.8  
Mounting torque  
Nm  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
2012-10-09  
Rev.1.0  
1

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