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TJ200F04M3L PDF预览

TJ200F04M3L

更新时间: 2024-11-21 14:57:47
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
11页 334K
描述
Not Recommended for New Design

TJ200F04M3L 技术参数

生命周期:Active包装说明:SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code:unknown风险等级:5.74
雪崩能效等级(Eas):924 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:40 V
最大漏极电流 (ID):200 A最大漏源导通电阻:0.0026 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:P-CHANNEL最大脉冲漏极电流 (IDM):600 A
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

TJ200F04M3L 数据手册

 浏览型号TJ200F04M3L的Datasheet PDF文件第2页浏览型号TJ200F04M3L的Datasheet PDF文件第3页浏览型号TJ200F04M3L的Datasheet PDF文件第4页浏览型号TJ200F04M3L的Datasheet PDF文件第5页浏览型号TJ200F04M3L的Datasheet PDF文件第6页浏览型号TJ200F04M3L的Datasheet PDF文件第7页 
TJ200F04M3L  
MOSFETs Silicon P-Channel MOS (U-MOS)  
TJ200F04M3L  
1. Applications  
Automotive  
DC-DC Converters  
Motor Drivers  
2. Features  
(1) AEC-Q101 qualified  
(2) Low drain-source on-resistance: RDS(ON) = 1.45 m(typ.) (VGS = -10 V)  
(3) Low leakage current: IDSS = -10 µA (max) (VDS = -40 V)  
(4) Enhancement mode: Vth = -2.0 to -3.0 V (VDS = -10 V, ID = -1 mA)  
3. Packaging and Internal Circuit  
1: Gate  
2: Drain (heatsink)  
3: Source  
TO-220SM(W)  
Start of commercial production  
2014-12  
©2015-2020  
2020-06-24  
Rev.8.0  
1
Toshiba Electronic Devices & Storage Corporation  

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