Dual N-Channel Enhancement Mode MOSFET
TGBLN6603-5DL8
Electrical Characteristics (@ TA = 25°C unless otherwise specified)
Symbol
Parameter
Test Condition
Min. Typ. Max. Unit
Static Characteristics
VDSS
IDSS
IGSS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
VGS = 0V, ID = 250μA
VDS = 48V, VGS = 0V
VGS = ±20V, VDS = 0V
60
-
-
-
-
-
1
V
μA
nA
-
±1 00
On Characteristics
RDS(ON)
Static Drain-Source On-resistance *2
VGS = 10V, ID = 10A
VGS = 4.5V, ID = 10A
VDS = VGS, ID = 250μA
-
-
13
17
17
24
mΩ
mΩ
V
VGS(th)
Gate Threshold Voltage
1
1.9
2.5
Dynamic Characteristics
CISS
COSS
CRSS
QG
Input Capacitance
-
-
-
-
-
-
736
173
6
-
-
-
-
-
-
VGS = 0V
Output Capacitance
VDS = 30V
f = 1.0MHz
pF
nC
Reverse Transfer Capacitance
Total Gate-Charge
16.2
3.8
2.2
VDD = 30V
VGS = 10V
ID = 10A
QGS
QGD
Gate to Source Charge
Gate to Drain (Miller) Charge
Switching Characteristics
td(ON)
Turn-on Delay Time
Turn-on Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
-
-
-
-
13
25
26
10
-
-
-
-
VDD = 30V
VGS = 10V
RG =10Ω
ID = 20A
tr
td(OFF)
tf
ns
Source-Drain Diode Characteristics
VSD
IS
Diode Forward Voltage *2
ISD = 10A, VGS = 0V, TJ = 25°C
-
-
-
-
0.9
-
1.2
17
-
V
A
Diode Continuous Forward Current *1,4
Reverse Recovery Time
trr
27
20
ns
nC
VR =30V, IF = 10A
di/dt = 100A/μs
Qrr
Reverse Recovery Charge
-
Notes:
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper
2. The data tested by pulsed, pulse width ≤ 300μs, duty cycle ≤ 2%
3. The EAS data shows Max. rating. The test condition is VDD = 25V, VGS = 10V, L = 0.1mH
4. The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation
5. The data is test on minimal footprint
MTM0736A: September 2022 [2.1]
www.gmesemi.com
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