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TEA1068 PDF预览

TEA1068

更新时间: 2024-11-06 22:42:23
品牌 Logo 应用领域
恩智浦 - NXP 光电二极管电话
页数 文件大小 规格书
24页 171K
描述
Versatile telephone transmission circuit with dialler interface

TEA1068 技术参数

生命周期:Obsolete零件包装代码:DIP
包装说明:DIP, DIP18,.3针数:18
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.68JESD-30 代码:R-PDIP-T18
长度:21.6 mm功能数量:1
端子数量:18最高工作温度:75 °C
最低工作温度:-25 °C封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装等效代码:DIP18,.3
封装形状:RECTANGULAR封装形式:IN-LINE
电源:3.95/7.5 V认证状态:Not Qualified
座面最大高度:4.7 mm子类别:Telephone Circuits
最大压摆率:0.0013 mA表面贴装:NO
技术:BIPOLAR电信集成电路类型:TELEPHONE SPEECH CIRCUIT
温度等级:COMMERCIAL EXTENDED端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
宽度:7.62 mmBase Number Matches:1

TEA1068 数据手册

 浏览型号TEA1068的Datasheet PDF文件第2页浏览型号TEA1068的Datasheet PDF文件第3页浏览型号TEA1068的Datasheet PDF文件第4页浏览型号TEA1068的Datasheet PDF文件第5页浏览型号TEA1068的Datasheet PDF文件第6页浏览型号TEA1068的Datasheet PDF文件第7页 
INTEGRATED CIRCUITS  
DATA SHEET  
TEA1068  
Versatile telephone transmission  
circuit with dialler interface  
1996 Apr 23  
Product specification  
Supersedes data of June 1990  
File under Integrated Circuits, IC03  

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