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TEA1081/C2 PDF预览

TEA1081/C2

更新时间: 2024-11-08 09:46:59
品牌 Logo 应用领域
恩智浦 - NXP 电信光电二极管电信集成电路
页数 文件大小 规格书
18页 115K
描述
IC SPECIALTY TELECOM CIRCUIT, PDIP8, 0.300 INCH, PLASTIC, SOT-97, DIP-8, Telecom IC:Other

TEA1081/C2 技术参数

生命周期:Obsolete零件包装代码:DIP
包装说明:DIP,针数:8
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.84JESD-30 代码:R-PDIP-T8
长度:9.5 mm功能数量:1
端子数量:8最高工作温度:70 °C
最低工作温度:-25 °C封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE认证状态:Not Qualified
座面最大高度:4.2 mm标称供电电压:4 V
表面贴装:NO电信集成电路类型:TELECOM CIRCUIT
温度等级:OTHER端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
宽度:7.62 mm

TEA1081/C2 数据手册

 浏览型号TEA1081/C2的Datasheet PDF文件第2页浏览型号TEA1081/C2的Datasheet PDF文件第3页浏览型号TEA1081/C2的Datasheet PDF文件第4页浏览型号TEA1081/C2的Datasheet PDF文件第5页浏览型号TEA1081/C2的Datasheet PDF文件第6页浏览型号TEA1081/C2的Datasheet PDF文件第7页 
INTEGRATED CIRCUITS  
DATA SHEET  
TEA1081  
Supply circuit with power-down for  
telephone set peripherals  
September 1994  
Product specification  
Supersedes data of February 1988  
File under Integrated Circuits, IC03  
Philips Semiconductors  

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