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TEA1064A/C2 PDF预览

TEA1064A/C2

更新时间: 2024-11-07 15:54:11
品牌 Logo 应用领域
恩智浦 - NXP 电信光电二极管电信集成电路
页数 文件大小 规格书
38页 303K
描述
IC TELEPHONE SPEECH CKT, PDIP20, 0.300 INCH, PLASTIC, SOT-146, DIP-20, Telephone Circuit

TEA1064A/C2 技术参数

生命周期:Obsolete零件包装代码:DIP
包装说明:DIP,针数:20
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.81Is Samacsys:N
JESD-30 代码:R-PDIP-T20长度:26.73 mm
功能数量:1端子数量:20
最高工作温度:75 °C最低工作温度:-25 °C
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
认证状态:Not Qualified座面最大高度:4.2 mm
标称供电电压:2.8 V表面贴装:NO
技术:BIPOLAR电信集成电路类型:TELEPHONE SPEECH CIRCUIT
温度等级:COMMERCIAL EXTENDED端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
宽度:7.62 mmBase Number Matches:1

TEA1064A/C2 数据手册

 浏览型号TEA1064A/C2的Datasheet PDF文件第2页浏览型号TEA1064A/C2的Datasheet PDF文件第3页浏览型号TEA1064A/C2的Datasheet PDF文件第4页浏览型号TEA1064A/C2的Datasheet PDF文件第5页浏览型号TEA1064A/C2的Datasheet PDF文件第6页浏览型号TEA1064A/C2的Datasheet PDF文件第7页 
INTEGRATED CIRCUITS  
DATA SHEET  
TEA1064A  
Low voltage versatile telephone  
transmission circuit with dialler  
interface and transmit level  
dynamic limiting  
March 1994  
Product specification  
File under Integrated Circuits, IC03A  

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