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TDA9898V2 PDF预览

TDA9898V2

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
103页 512K
描述
Multistandard hybrid IF processing

TDA9898V2 数据手册

 浏览型号TDA9898V2的Datasheet PDF文件第4页浏览型号TDA9898V2的Datasheet PDF文件第5页浏览型号TDA9898V2的Datasheet PDF文件第6页浏览型号TDA9898V2的Datasheet PDF文件第8页浏览型号TDA9898V2的Datasheet PDF文件第9页浏览型号TDA9898V2的Datasheet PDF文件第10页 
TDA9897; TDA9898  
NXP Semiconductors  
Multistandard hybrid IF processing  
[7] With single-ended load for fIF < 45 MHz RL 1 kand CL 5 pF to ground and for fIF = 45 MHz to 60 MHz RL = 1 kand CL 3 pF to  
ground.  
[8] This parameter is not tested during production and is only given as application information.  
[9] Noise level is measured without input signal but AGC adjusted corresponding to the given input level.  
[10] Set with AGC nominal output voltage as reference. For C/N measurement switch input signal off.  
[11] The tolerance of the reference frequency determines the accuracy of VIF AFC, RIF AFC, FM demodulator center frequency, maximum  
FM deviation, sound trap frequency, LIF band-pass cut-off frequency and ZIF low-pass cut-off frequency as well as the accuracy of the  
synthesizer.  
5. Ordering information  
Table 2.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
TDA9897HL/V2/S1 LQFP48  
plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm  
SOT313-2  
SOT619-1  
TDA9897HN/V2  
HVQFN48 plastic thermal enhanced very thin quad flat package; no leads;  
48 terminals; body 7 × 7 × 0.85 mm  
TDA9898HL/V2/S1 LQFP48  
plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm  
SOT313-2  
SOT619-1  
TDA9898HN/V2  
HVQFN48 plastic thermal enhanced very thin quad flat package; no leads;  
48 terminals; body 7 × 7 × 0.85 mm  
TDA9897_TDA9898_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 11 January 2008  
7 of 103  

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