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TDA8007BHL/C3 PDF预览

TDA8007BHL/C3

更新时间: 2024-01-06 06:42:04
品牌 Logo 应用领域
恩智浦 - NXP 外围集成电路
页数 文件大小 规格书
59页 1641K
描述
IC SPECIALTY MICROPROCESSOR CIRCUIT, PQFP48, 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-313-2, LQFP-48, Microprocessor IC:Other

TDA8007BHL/C3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFP
包装说明:LFQFP, QFP48,.35SQ,20针数:48
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:5.79JESD-30 代码:S-PQFP-G48
JESD-609代码:e3长度:7 mm
湿度敏感等级:1端子数量:48
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:LFQFP
封装等效代码:QFP48,.35SQ,20封装形状:SQUARE
封装形式:FLATPACK, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:3/5 V认证状态:Not Qualified
座面最大高度:1.6 mm子类别:Other Microprocessor ICs
最大压摆率:315 mA最大供电电压:6 V
最小供电电压:2.7 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:7 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUIT
Base Number Matches:1

TDA8007BHL/C3 数据手册

 浏览型号TDA8007BHL/C3的Datasheet PDF文件第2页浏览型号TDA8007BHL/C3的Datasheet PDF文件第3页浏览型号TDA8007BHL/C3的Datasheet PDF文件第4页浏览型号TDA8007BHL/C3的Datasheet PDF文件第5页浏览型号TDA8007BHL/C3的Datasheet PDF文件第6页浏览型号TDA8007BHL/C3的Datasheet PDF文件第7页 
AN01054  
Smart Card Interface using TDA8007BHL/C2/C3  
Rev. 1.1 — 27 March 2012  
Application note  
Document information  
Info  
Content  
Keywords  
TDA8007BHL/C2, TDA8007BHL/C3, Smart card interface, Protocol  
T = 0 and T=1, Double smart card reader, Three smart card reader  
This application note is a generic documentation given the basic  
rules to use the TDA8007BHL/C2 or C3 and handles a  
communication between a system controller and two or three  
smart cards.  
Abstract  
The TDA8007B functions are controlled by micro-controller  
through a parallel interface in both modes, multiplexed and non  
multiplexed.  

TDA8007BHL/C3 替代型号

型号 品牌 替代类型 描述 数据表
TDA8007BHL NXP

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Double multiprotocol IC card interface

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