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SZMMSZ56T1G PDF预览

SZMMSZ56T1G

更新时间： 2024-11-03 11:01:39
品牌 Logo 应用领域
安森美 - ONSEMI 测试光电二极管齐纳二极管
页数 文件大小 规格书
6页 77K
描述
500 mW; 5% Zener Diode Voltage Regulator

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中文翻译

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SZMMSZ56T1G 技术参数

是否无铅： 不含铅生命周期：Active
包装说明：R-PDSO-G2Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8541.10.00.50
Factory Lead Time：4 weeks风险等级：5.68
配置：SINGLE二极管元件材料：SILICON
二极管类型：ZENER DIODEJESD-30 代码：R-PDSO-G2
JESD-609代码：e3湿度敏感等级：1
元件数量：1端子数量：2
最高工作温度：150 °C最低工作温度：-55 °C
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：SMALL OUTLINE极性：UNIDIRECTIONAL
最大功率耗散：0.5 W参考标准：AEC-Q101
标称参考电压：56 V表面贴装：YES
技术：ZENER端子面层：Tin (Sn)
端子形式：GULL WING端子位置：DUAL
最大电压容差：5%工作测试电流：5 mA
Base Number Matches：1

SZMMSZ56T1G 数据手册

 浏览型号SZMMSZ56T1G的Datasheet PDF文件第2页浏览型号SZMMSZ56T1G的Datasheet PDF文件第3页浏览型号SZMMSZ56T1G的Datasheet PDF文件第4页浏览型号SZMMSZ56T1G的Datasheet PDF文件第5页浏览型号SZMMSZ56T1G的Datasheet PDF文件第6页 
MMSZ2V4T1 Series  
Zener Voltage Regulators  
500 mW SOD−123 Surface Mount  
Three complete series of Zener diodes are offered in the convenient,  
surface mount plastic SOD−123 package. These devices provide a  
convenient alternative to the leadless 34−package style.  
http://onsemi.com  
Features  
• 500 mW Rating on FR−4 or FR−5 Board  
1
2
• Wide Zener Reverse Voltage Range − 2.4 V to 56 V  
• Package Designed for Optimal Automated Board Assembly  
• Small Package Size for High Density Applications  
• ESD Rating of Class 3 (>16 kV) per Human Body Model  
• Pb−Free Package is Available  
Cathode  
Anode  
2
Mechanical Characteristics  
1
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily Solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
SOD−123  
CASE 425  
STYLE 1  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
MARKING DIAGRAM  
xx M  
MAXIMUM RATINGS  
Rating  
Symbol  
Max  
Unit  
Total Power Dissipation on FR−5 Board,  
P
D
xx = Specific Device Code  
500  
6.7  
mW  
mW/°C  
(Note 1) @ T = 75°C  
L
M
= Date Code  
Derated above 75°C  
Thermal Resistance −  
Junction−to−Ambient (Note 2)  
R
340  
150  
°C/W  
°C/W  
°C  
q
JA  
ORDERING INFORMATION  
Thermal Resistance −  
Junction−to−Lead (Note 2)  
R
q
JL  
†
Device  
Package  
Shipping  
Junction and Storage  
Temperature Range  
T , T  
J
−55 to  
+150  
MMSZxxxT1  
MMSZxxxT3*  
SOD−123  
3000/Tape & Reel  
stg  
SOD−123 10,000/Tape & Reel  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
1. FR−5 = 3.5 X 1.5 inches.  
2. Thermal Resistance measurement obtained via infrared Scan Method.  
Individual devices are listed on page 3 of this data sheet.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
December, 2004 − Rev. 5  
MMSZ2V4T1/D  
 
123456

中文翻译

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