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SZMMSZ5269BT1G PDF预览

SZMMSZ5269BT1G

更新时间： 2024-11-02 21:12:31
品牌 Logo 应用领域
安森美 - ONSEMI 测试光电二极管
页数 文件大小 规格书
7页 166K
描述
87 V, 0.5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, LEAD FREE, PLASTIC, CASE 425-04, 2 PIN

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SZMMSZ5269BT1G 技术参数

是否Rohs认证： 符合生命周期：Obsolete
包装说明：R-PDSO-G2Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8541.10.00.50
风险等级：5.84配置：SINGLE
二极管元件材料：SILICON二极管类型：ZENER DIODE
JESD-30 代码：R-PDSO-G2元件数量：1
端子数量：2最高工作温度：150 °C
最低工作温度：-55 °C封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：NOT SPECIFIED极性：UNIDIRECTIONAL
最大功率耗散：0.5 W参考标准：AEC-Q101
标称参考电压：87 V表面贴装：YES
技术：ZENER端子形式：GULL WING
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
最大电压容差：5%工作测试电流：1.4 mA
Base Number Matches：1

SZMMSZ5269BT1G 数据手册

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MMSZ52xxBT1G Series,  
SZMMSZ52xxBT1G Series  
Zener Voltage Regulators  
500 mW SOD−123 Surface Mount  
Three complete series of Zener diodes are offered in the convenient,  
surface mount plastic SOD−123 package. These devices provide a  
convenient alternative to the leadless 34−package style.  
http://onsemi.com  
Features  
500 mW Rating on FR−4 or FR−5 Board  
Wide Zener Reverse Voltage Range − 2.4 V to 110 V  
Package Designed for Optimal Automated Board Assembly  
Small Package Size for High Density Applications  
General Purpose, Medium Current  
SOD−123  
CASE 425  
STYLE 1  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
1
2
Cathode  
Anode  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
MARKING DIAGRAM  
Pb−Free Packages are Available*  
xx MG  
Mechanical Characteristics:  
1
G
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260C for 10 Seconds  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
xx = Device Code (Refer to page 3)  
M
G
= Date Code  
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
MAXIMUM RATINGS  
†
Rating  
Symbol  
Max  
Units  
Device  
Package  
Shipping  
Total Power Dissipation on FR−5 Board,  
P
MMSZ52xxBT1G  
SOD−123  
(Pb−Free)  
3,000 /  
Tape & Reel  
D
(Note 1) @ T = 75C  
500  
6.7  
mW  
L
Derated above 75C  
mW/C  
SZMMSZ52xxBT1G SOD−123  
(Pb−Free)  
3,000 /  
Tape & Reel  
Thermal Resistance, Junction−to−Ambient  
(Note 2)  
R
340  
C/W  
C/W  
C  
q
JA  
MMSZ52xxBT3G  
SOD−123  
(Pb−Free)  
10,000 /  
Tape & Reel  
Thermal Resistance, Junction−to−Lead  
(Note 2)  
R
q
JL  
150  
SZMMSZ52xxBT3G SOD−123  
(Pb−Free)  
10,000 /  
Tape & Reel  
Junction and Storage Temperature Range T , T  
−55 to +150  
J
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.  
2. Thermal Resistance measurement obtained via infrared Scan Method.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
February, 2012 − Rev. 11  
MMSZ5221BT1/D  
 
1234567

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