MM3ZxxxST1G Series,
SZMM3ZxxxST1G Series
Zener Voltage Regulators
200 mW SOD−323 Surface Mount
Tight Tolerance Portfolio
http://onsemi.com
This series of Zener diodes is packaged in a SOD−323 surface
mount package that has a power dissipation of 200 mW. They are
designed to provide voltage regulation protection and are especially
attractive in situations where space is at a premium. They are well
suited for applications such as cellular phones, hand−held portables,
and high density PC boards.
SOD−323
CASE 477
STYLE 1
Specification Features
• Standard Zener Breakdown Voltage Range − 3.3 V to 36 V
• Steady State Power Rating of 200 mW
• Small Body Outline Dimensions:
− 0.067″ x 0.049″ (1.7 mm x 1.25 mm)
• Low Body Height: 0.035″ (0.9 mm)
• Package Weight: 4.507 mg/unit
1
2
Cathode
Anode
MARKING DIAGRAM
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• Tight Tolerance V
Z
XXMG
• AEC−Q101 Qualified and PPAP Capable
G
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
XX= Specific Device Code
M = Date Code*
G
= Pb−Free Package
Mechanical Characteristics:
(Note: Microdot may be in either location)
CASE: Void-free, transfer-molded plastic
FINISH: All external surfaces are corrosion resistant
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
LEADS: Plated with Pb−Sn or Sn only (Pb−Free)
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MOUNTING POSITION: Any
*Date Code orientation may vary
depending upon manufacturing location.
ORDERING INFORMATION
†
Device
Package
Shipping
MM3ZxxxST1G
SOD−323
(Pb−Free)
3,000 /
Tape & Reel
SZMM3ZxxxST1G SOD−323
(Pb−Free)
3,000 /
Tape & Reel
MM3ZxxxST3G
SOD−323
(Pb−Free)
10,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
June, 2013 − Rev. 20
MM3Z2V4ST1/D