是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | MSOP |
包装说明: | HTSSOP, | 针数: | 10 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.62 | JESD-30 代码: | R-PDSO-G10 |
JESD-609代码: | e3 | 长度: | 3 mm |
湿度敏感等级: | 3 | 功能数量: | 1 |
端子数量: | 10 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HTSSOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 1.1 mm |
标称供电电压: | 3.3 V | 表面贴装: | YES |
电信集成电路类型: | TELECOM CIRCUIT | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 3 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
SY88403BLEY | MICREL |
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