Datasheet > SW3225R15JL

SW3225R15JL

更新时间： 2022-12-16 22:55:42

品牌	Logo	应用领域
ABC		电感器
页数	文件大小	规格书
8页	624K
描述
WOUND CHIP INDUCTOR

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SW3225R15JL 数据手册

SPECIFICATION FOR APPROVAL

REF :

PROD.

NAME

PAGE: 6

ABC'S DWG NO.

ABC'S ITEM NO.

SW3225□□□□L□-□□□

WOUND CHIP INDUCTOR

Ⅸ RELIABILITY TEST：

Test items

Specifications

Test conditions / Test methods

SRF

RDC

Refer to standard electrical

characteristic list

HP-4291A With HP-16193 Test fixture .

HP-4291A With HP-16193 Test fixture.

HP-8753E

HP-4338B

Rated currert

IDC

Applied the current to coils the

inductance change shall be less

than 10% to initial value and

temperature rise shall not be

more than 20℃

Temperature

rise test

20℃ max.

1.Applied the allowed DC current

for 10 minutes.

2.Temperature measure by digtal

surface thermometer .

Over load test

After test，Inductors shall be no

evidence of electrical and

mechanical damage

Applied 2 times of rated allowed

DC current to inductor for a

period of five minutes .

Withstanding

voltage test

After test，Inductors shall be no

evidence of electrical and

mechanical damage

500VAC between inductor terminals and

center of case for a maximum 1 minute.

Insulation

resistance test

1000 MΩ min.

100 VDC between inductor

terminals and center case.

Vibration test

1.There shall be no case

deformation or change in

appearance.

1.Amplitude：1.5 m/m

(Low frequency)

2.Frequency：10-55-10Hz/min.

3.Direction ：X,Y,Z

4.Duration ：2HRS/X,Y,Z

2.Inductance shall not change

more than ±5%

Vibration test

(Low frequency )

Inductors shall be dropped 10

times from a height of 1m onto

3cm wooden board .

3.Q shall not change

more than±10%

Resistance to

soldering heat

Inductors shall be reflowed onto a P.C. board

using solder paste. Solder process

shall be 230℃ for 20±2 seconds

and 260℃ for 5±2 seconds

The metalized area must

have 90% min. solder

coverage

Dip pads in flux (Alpha 100 or equiv.) and

dip in solder pot at 230±5℃ for 5 seconds

Solderability test

AR-001A

1...3 4 567 8

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