SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 1
SW3225□□□□L□-□□□
ABC'S DWG NO.
ABC'S ITEM NO.
WOUND CHIP INDUCTOR
Ⅰ CONFIGURATION & DIMENSIONS:
A
A
B
C
D
E
F
G
H
I
:
:
:
:
:
:
:
:
:
3.20±0.2
2.50±0.2
2.10±0.2
1.10
0.50
2.20
1.80
2.80
0.70
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
R12
Marking
Inductance Code
E
F
E
G
I
I
( PCB Pattern )
Ⅱ SCHEMATIC DIAGRAM:
Ⅲ MATERIALS:
d
a
a
b
c
d
e
Core:Ceramic
WIRE :Enamelled copper wire (class H)
b
c
Mo / Mn + Ni + Au
Terminal:
Peak Temp:260℃ max.
Encapsulate:Epoxy
Max time above 230℃ :50sec max.
Max time above 200℃ :70sec max.
Temperature
Remark:Products comply with RoHS'
Rising Area
Preheat Area
Reflow Area Forced Cooling Area
requirements
+2.0 ~ 4.0℃
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
/ sec max.
260℃
250
200
150
100
50
230℃
50sec max.
Ⅳ GENERAL SPECIFICATION:
a
Temp rise :15℃ max.
b
Rated current:Current cause inductance
drop within 10% max.
70sec max.
c
d
Storage temp.:-40℃ ----+125℃
Operating temp.:-40℃----+125℃
50
100
150
Time ( seconds )
200
250
0
AR-001A