生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | VFBGA, | 针数: | 8 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.84 | JESD-30 代码: | S-PBGA-B8 |
长度: | 1.57 mm | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -30 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 认证状态: | Not Qualified |
座面最大高度: | 0.715 mm | 标称供电电压: | 2.7 V |
表面贴装: | YES | 电信集成电路类型: | TELECOM CIRCUIT |
温度等级: | OTHER | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
宽度: | 1.57 mm | Base Number Matches: | 1 |
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