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SST39VF040-75-4C-WME PDF预览

SST39VF040-75-4C-WME

更新时间: 2024-11-07 00:19:19
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SST /
页数 文件大小 规格书
24页 640K
描述
512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit (x8) Multi-Purpose Flash

SST39VF040-75-4C-WME 数据手册

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512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit (x8) Multi-Purpose Flash  
SST39LF512 / SST39LF010 / SST39LF020 / SST39LF040  
SST39VF512 / SST39VF010 / SST39VF020 / SST39VF040  
SST39LF/VF512 / 010 / 020 / 0403.0 & 2.7V 512Kb / 1Mb / 2Mb / 4Mb (x8) MPF memories  
Data Sheet  
FEATURES:  
Organized as 64K x8 / 128K x8 / 256K x8 / 512K x8  
Single Voltage Read and Write Operations  
– 3.0-3.6V for SST39LF512/010/020/040  
– 2.7-3.6V for SST39VF512/010/020/040  
Superior Reliability  
– Endurance: 100,000 Cycles (typical)  
– Greater than 100 years Data Retention  
Low Power Consumption  
(typical values at 14 MHz)  
– Active Current: 5 mA (typical)  
– Standby Current: 1 µA (typical)  
Sector-Erase Capability  
– Uniform 4 KByte sectors  
Fast Read Access Time:  
Fast Erase and Byte-Program:  
– Sector-Erase Time: 18 ms (typical)  
– Chip-Erase Time: 70 ms (typical)  
– Byte-Program Time: 14 µs (typical)  
– Chip Rewrite Time:  
1 second (typical) for SST39LF/VF512  
2 seconds (typical) for SST39LF/VF010  
4 seconds (typical) for SST39LF/VF020  
8 seconds (typical) for SST39LF/VF040  
Automatic Write Timing  
– Internal VPP Generation  
End-of-Write Detection  
Toggle Bit  
– Data# Polling  
CMOS I/O Compatibility  
JEDEC Standard  
– Flash EEPROM Pinouts and command sets  
Packages Available  
– 45 ns for SST39LF512/010/020/040  
– 55 ns for SST39LF020/040  
– 70 ns for SST39VF512/010/020/040  
Latched Address and Data  
– 32-lead PLCC  
– 32-lead TSOP (8mm x 14mm)  
– 48-ball TFBGA (6mm x 8mm)  
– 34-ball WFBGA (4mm x 6mm) for 1M and 2M  
All devices are RoHS compliant  
PRODUCT DESCRIPTION  
The SST39LF512, SST39LF010, SST39LF020, SST39LF040  
and SST39VF512, SST39VF010, SST39VF020, SST39VF040  
are 64K x8, 128K x8, 256K x8 and 5124K x8 CMOS Multi-Pur-  
pose Flash (MPF) manufactured with SST’s proprietary, high per-  
formance CMOS SuperFlash technology. The split-gate cell  
design and thick-oxide tunneling injector attain better reliability and  
manufacturability compared with alternate approaches. The  
SST39LF512/010/020/040 devices write (Program or Erase) with  
a 3.0-3.6V power supply. The SST39VF512/010/020/040 devices  
write with a 2.7-3.6V power supply. The devices conform to  
JEDEC standard pinouts for x8 memories.  
ration, or data memory. For all system applications, they  
significantly improves performance and reliability, while low-  
ering power consumption. They inherently use less energy  
during Erase and Program than alternative flash technolo-  
gies. The total energy consumed is a function of the  
applied voltage, current, and time of application. Since for  
any given voltage range, the SuperFlash technology uses  
less current to program and has a shorter erase time, the  
total energy consumed during any Erase or Program oper-  
ation is less than alternative flash technologies. These  
devices also improve flexibility while lowering the cost for  
program, data, and configuration storage applications.  
Featuring high performance Byte-Program, the  
SST39LF512/010/020/040 and SST39VF512/010/020/  
040 devices provide a maximum Byte-Program time of 20  
µsec. These devices use Toggle Bit or Data# Polling to indi-  
cate the completion of Program operation. To protect  
against inadvertent write, they have on-chip hardware and  
Software Data Protection schemes. Designed, manufac-  
tured, and tested for a wide spectrum of applications, they  
are offered with a guaranteed typical endurance of  
100,000 cycles. Data retention is rated at greater than 100  
years.  
The SuperFlash technology provides fixed Erase and Pro-  
gram times, independent of the number of Erase/Program  
cycles that have occurred. Therefore the system software  
or hardware does not have to be modified or de-rated as is  
necessary with alternative flash technologies, whose Erase  
and Program times increase with accumulated Erase/Pro-  
gram cycles.  
To meet surface mount requirements, the SST39LF512/  
010/020/040 and SST39VF512/010/020/040 devices are  
offered in 32-lead PLCC and 32-lead TSOP packages. The  
SST39LF/VF010 and SST39LF/VF020 are also offered in  
a 48-ball TFBGA package. See Figures 2, 3, 4, and 5 for  
pin assignments.  
The SST39LF512/010/020/040 and SST39VF512/010/  
020/040 devices are suited for applications that require  
convenient and economical updating of program, configu-  
©2010 Silicon Storage Technology, Inc.  
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.  
MPF is a trademark of Silicon Storage Technology, Inc.  
S71150-14-000  
1
01/10  
These specifications are subject to change without notice.  

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