SS1020-C-Q1 THRU SS10B0-C-Q1
10.0A Surface Mount Schottky Barrier
Rectifiers - 20V-200V
Package outline
Features
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
SMC/DO-214AB
Metal silicon junction,majority carrier conduction
Low power loss,high efficiency
0.245(6.22)
0.220(5.59)
0.126 (3.20)
0.114 (2.90)
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
250 C/10 seconds at terminals
Compliant to RoHS Directive 2011/65/EU
0.280(7.11)
0.260(6.60)
0.012(0.305)
0.006(0.152)
Suffix "-Q1" for AEC-Q101
0.103(2.62)
0.079(2.06)
Mechanical data
Case: JEDEC DO-214AB molded plastic body
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
0.060(1.52)
0.030(0.76)
0.008(0.203)MAX.
Polarity: Color band denotes cathode end
Mounting Position: Any
0.320(8.13)
0.305(7.75)
Dimensions in inches and (millimeters)
Maximum ratings and Electrical Characteristics (AT TA=25oC unless otherwise noted)
Symbol
MIN.
MAX.
PARAMETER
CONDITIONS
UNIT
A
TYP.
IO
Forward rectified current
See Fig.
10.0
IFSM
Forward surge current
A
200
8.3ms single half sine-wave (JEDEC methode)
20V - 60V
80V - 200V
20V - 60V
80V - 200V
IR
Reverse current
Reverse current
Thermal resistance
mA
IR
mA
RθJC
2.0
OC/W
NOTE 1
C
pF
OC
Diode junction capacitance
Storage temperature
550
f=1MHz and applied 4V DC reverse voltage
J
+150
-65
TSTG
Note:
1.P.C.B. mounted with 0.6x0.6”(16x16mm) copper pad areas
Operating
temperature
TJ, (OC)
*1
*3
*4
VF
*2
VRMS
VR
SYMBOLS
VRRM
(V)
(V)
0.55
0.70
(V)
(V)
SS1020-C-Q1
SS1030-C-Q1
SS1040-C-Q1
SS1045-C-Q1
SS1060-C-Q1
SS1080-C-Q1
SS10A0-C-Q1
SS1015-C-Q1
20
30
40
45
14
21
28
32
42
56
70
105
20
30
40
45
60
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage@IF=10.0A
60
80
-55 to +150
80
100
150
200
100
150
200
0.85
0.90
140
SS10B0-C-Q1
http://www.anbonsemi.com
TEL:+86-755-23776891
FAX:+86-755-81482182
Document ID
Issued Date
Revised Date
Revision
Page.
2023/06/30
H
AS-1070091
2018/02/01
3
Page 1